WMSIC Electronic Components

Product RFQ

THGBMDG5D1LBAIL 4GB eMMC Embedded Flash Memory THGBMDG5D1LBAIL BGA-153

Use the form for single models, category sourcing, and multi-line BOM requirements.

ModelTHGBMDG5D1LBAIL
PackageBGA-153
BrandKIOXIA
StockRFQ

Product details

Product name
停产 THGBMDG5D1LBAIL
Type
eMMC
Unit
-
Minimum package
152
存储容量
4GB
Operating Temperature
-25℃~+85℃
recent_sales
0

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Incoming package verification Our RFQ workflow is designed for multi-line component lists, substitute checks, package confirmation, and delivery planning.
Model and BOM matching Our RFQ workflow is designed for multi-line component lists, substitute checks, package confirmation, and delivery planning.
Quote, lead time, and logistics plan Our RFQ workflow is designed for multi-line component lists, substitute checks, package confirmation, and delivery planning.

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