WMSIC Electronic Components

ADI/LINEAR DS2401Z+T&R DS2401Z

ModelDS2401Z+T&R
PackageSOT-223
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR DS2401Z+T&R
Type
ADI/LINEAR
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
DS2401Z+T&R
Electronic Component
1
Package
SOT-223
Electronic Component
Authentication / Encryption IC
Electronic Component
0.309g
Electronic Component
1
Features
ID
Electronic Component
BM0258839468
Operating Temperature
40℃~+85℃
Operating Voltage
2.8V~6V
Interface Type
1-Wire
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DS2401Z+T&R 产品概述

一、产品简介

DS2401Z+T&R 是来自 ADI(亚德诺)/LINEAR 的硅片序列号(Silicon Serial Number)安全/验证专用 IC,采用 1-Wire 单总线接口。工作电压范围 2.8V~6V,工作温度范围 -40℃~+85℃,封装为 SOT-223,按卷带(Tape & Reel)供货,适合批量贴装与生产线安装。器件在出厂时带有唯一的 64 位 ROM 序列号,可用于可靠的设备唯一标识与防伪认证。

二、主要特性

  • 单线(1-Wire)接口,节省引脚与布线成本
  • 出厂编程的唯一 64 位硅片序列号(ROM),不可更改
  • 宽电压工作范围:2.8V~6V,兼容 3.3V/5V 系统
  • 宽温度范围:-40℃~+85℃,适应工业级环境
  • 封装:SOT-223,适用于机械强度和散热要求较高的场合
  • 供货形式:T&R(卷带)支持自动贴片生产

三、功能说明与使用要点

DS2401Z 通过标准 1-Wire 总线与主控器通信,通常仅需一根数据线(加上公共地)。器件兼容 1-Wire 规范常用命令(如 Read ROM),可在总线上被逐一识别并读取其固有 ID。使用时应在数据线上加装上拉电阻(常见值 3.3V 系统可用 2.2k~4.7k,5V 系统常用 4.7k),并注意总线驱动能力与线长。若电源引脚参与供电,请按照数据手册加装去耦电容;如采用寄生供电方式,应遵循厂方推荐的时序与负载限制。

四、典型应用

  • 设备唯一识别与出厂序列号管理
  • 资产跟踪、库存管理与物流追踪
  • 防伪认证与产品验证体系
  • 生产测试、自动化上线烧录与校验
  • 与 MCU 或数据库系统联动的安全接入控制

五、封装与订购建议

DS2401Z 提供 SOT-223 封装,适合对机械牢固性和散热有一定要求的应用。T&R(卷带)包装便于 SMT 自动化生产。订购时请参考完整料号(含包装与温度范围标识),并索取最新版规格书以确认封装引脚图、焊接温度曲线和焊盘建议尺寸。

六、设计注意事项与可靠性建议

  • 在 PCB 设计中为 1-Wire 总线留出合适的去耦与 ESD 抗扰保护;关键位置可增加 TVS 或回流保护元件。
  • 多器件共总线时,注意总线时序与上拉阻值的平衡,避免长分支线和大阻抗。
  • 初期样机验证请测量读出 ROM 的正确性与总线稳定性,确认在目标环境温度、电压波动下均能可靠识别。
  • 最终量产前,请严格参考 ADI/LINEAR 提供的可靠性与焊接工艺指南,确保良率与长期稳定性。

如需器件数据手册、参考电路或封装尺寸图,请提供联系方式或具体应用场景,以便进一步提供精准技术资料与布局建议。

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