Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
AMASS XT30UPB-M XT30UPB
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- AMASS XT30UPB-M
- Type
- AMASS
- Minimum package
- 500 袋
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- AMASS
- Electronic Component
- XT30UPB-M
- Electronic Component
- 1
- Package
- Electronic Component
- Type
- Electronic Component
- Electronic Component
- Power Supply Connector
- Electronic Component
- 1.08g
- Electronic Component
- Electronic Component
- Electronic Component
- 1
- Electronic Component
- BM0227715671
- Interface
- Electronic Component
- Contact Resistor
- 0.65mΩ
- Electronic Component
- PA
- Electronic Component
- Electronic Component
- Voltage
- 500VDC
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XT30UPB-M 产品概述
一、产品简介
XT30UPB-M 是 AMASS（艾迈斯）推出的一款直插式航模电源插头，属 XT30 系列的 PCB 插头（THT 直插公头）。本产品为 2 针直型设计，外观黄色，专为小型无人机、航模以及便携式电源模块的直流供电连接而设计，兼顾高电流承载与低接触电阻。
二、主要参数
- 额定电流：15 A
- 额定电压：500 VDC
- 引脚数：2 PIN（公头）
- 接触电阻：0.65 mΩ（典型值）
- 颜色：黄色
- 接口形态：公头（直型）
- 封装形式：PCB THT 直插
三、结构与材质
- 绝缘体材质：聚酰胺（PA），具有良好的机械强度和耐热性，适合高频振动环境。
- 触点材质：铜基体，表面镀金处理，镀金可以降低接触电阻并提高抗腐蚀性能，确保长期可靠接触。
- 机体设计：紧凑的外形和标准化针距，便于与同系列插座配合使用并实现可靠的电气连接。
四、电气与热性能要点
- 低接触电阻（0.65 mΩ）能有效减小在 15A 工作电流下的压降与发热，适合短时高电流放电与持续供电场合。
- 额定 500 VDC 意味着产品在小型直流系统中具备较高的绝缘裕量，但在高压应用时仍需考虑爬电距离与 PCB 布局。
- 建议不长期超越额定电流运行，并做好散热与连接处的可靠固定，避免因接触不良造成局部发热。
五、安装与使用建议
- 使用 THT 方式焊接到 PCB，上板时注意对齐与焊脚焊接质量，推荐采用波峰或手工焊接时使用适当的焊接温度与时间以保护 PA 绝缘件。
- 在强振环境（航模、无人机）中，建议辅以机械固定或环氧加固以防焊点疲劳失效。
- 安装时注意极性标识，避免反接导致器件或系统损坏。配套使用标准 XT30 母座以保证可靠配合。
六、典型应用场景
- 航模与多旋翼无人机电源连接（电池—电调—动力系统）
- 小型电池组与充电系统的快速连接器
- 便携式 DC 电源模块、功率分配板与实验台电源接口
七、注意事项
- 避免在超过额定电流或异常振动条件下长时间使用；如需频繁插拔或更高电流，请选择更大规格连接器。
- 保持触点清洁，避免油污或氧化物影响接触电阻；必要时使用电子接点清洁剂清洁。
- 采购时请确认型号 XT30UPB-M 与 AMASS（艾迈斯）品牌信息，以确保与系统的尺寸与电气规格匹配。
此产品以其紧凑结构、低接触电阻与可靠的材料选型，适合对体积、重量与电气性能有较高要求的直流电源连接场合。若需更详细的机械尺寸图或焊接建议，请提供 PCB 布局需求或联系供应商索取规格书。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
