WMSIC Electronic Components

AOTE ATM3063-CUH-SE ATM3063

ModelATM3063-CUH-SE
PackageSOP-4
BrandAOTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AOTE ATM3063-CUH-SE
Type
AOTE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AOTE
Electronic Component
ATM3063-CUH-SE
Electronic Component
1
Package
SOP-4
Electronic Component
Thyristor Output Optocoupler
Electronic Component
0.214g
Terminal Block
4
Electronic Component
1
Channel Count
1
Staticdv / dt
1000V/us
Electronic Component
BM0257614104
Operating Temperature
55℃~+110℃
Current
60mA
Surge Current
1A
Load Voltage
600V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ATM3063-CuH-SE 产品概述

一、产品简介

ATM3063-CuH-SE 是奥特(AOTE)推出的一款单通道光耦合器,输入为发光二极管(LED),输出为双向可控硅(双向可控硅/可控硅式输出),带过零(Zero-cross)功能,封装为 SOP-4。器件集成了光电隔离与交流开关功能,适合对隔离要求高且需控制交流小电流负载的场合。

二、主要参数与特性

  • 输出类型:双向可控硅(支持交流导通);带过零功能,降低开关干扰。
  • 输出电流:有效值 It(rms) 100 mA,稳态额定导通电流 60 mA(参考规格);浪涌电流可达 1 A(瞬时)。
  • 负载/耐压能力:最大负载电压(阻断电压)可达 600 V。
  • 隔离能力:工作端/控制端隔离电压 Vrms 3.75 kV,适用于高隔离要求的应用。
  • 静态 dv/dt:1000 V/µs(静态条件下可能对误触发敏感,需要合理抑制)。
  • LED 正向压降:Vf ≈ 1.3 V,LED 最大正向电流 60 mA(建议典型驱动电流 1–20 mA,以延长寿命并降低发热)。
  • 环境与功耗:工作温度 -55 ℃ ~ +110 ℃;器件耗散功率 Pd = 330 mW。
  • 封装与引脚:SOP-4,4 引脚单通道封装,便于 PCB 布局与表贴安装。

三、典型应用场景

  • 家电与照明控制中的小功率交流开关,例如电子开关、指示灯、继电器替代方案。
  • 智能家居、楼宇自控中低电流交流负载控制(安全隔离要求场合)。
  • 工业控制中对信号隔离且开关电流较小的交流控制回路。
  • 用于形成固态继电器(SSR)或与微控制器直接接口的隔离开关模块。

四、使用建议与典型接线

  • LED 驱动:根据驱动电压计算限流电阻 R = (Vdrive - Vf) / If。例如 MCU 5 V 输出、期望 If = 10 mA 时,R ≈ (5 − 1.3) / 0.01 ≈ 370 Ω(取 360–390 Ω)。
  • 过零特性:器件带过零功能能在接近零电压时触发,适合降低电磁干扰与限流性负载的平滑开合。对感性负载或高 dv/dt 环境,建议在输出两端并联 RC 吸收网络或采用噪声抑制电路以防误触发(R 值通常为数百欧至数千欧,C 为几十至几百纳法拉,需按实际工况验证)。
  • 功率与热管理:工作电流不得长期超过 It(rms) 100 mA,器件耗散功率 Pd=330 mW,注意 PCB 散热与布局,避免长期高温工况影响可靠性。
  • 安全与隔离:保持适当爬电距离与绝缘材料匹配,利用 3.75 kV 隔离能力实现信号端与电网端电气隔离设计。

五、可靠性与封装信息

SOP-4 表面贴装封装利于自动化生产及紧凑 PCB 布局。器件额定工作温度范围宽(-55 ~ +110 ℃),适应工业级环境。建议在设计前查阅完整数据手册以获取详尽的极限参数、引脚定义、典型波形与耐久性试验数据,以确保在目标应用中的长期可靠性。

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