WMSIC Electronic Components

AOTE TLP181GB-S TLP181GB

ModelTLP181GB-S
PackageSOP-4
BrandAOTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AOTE TLP181GB-S
Type
AOTE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AOTE
Electronic Component
TLP181GB-S
Electronic Component
1
Package
SOP-4
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.215g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0257614111
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP181GB-S(AOTE 奥特)光耦产品概述

一、产品简介

TLP181GB-S 是一款光电三极管输出的高速隔离光耦,封装为 SOP-4,由 AOTE(奥特)生产。器件输入为 DC 驱动的 LED,输出为光电晶体管,可在工业控制、微控制器接口、信号隔离和电源反馈等场景中实现电气隔离与信号传输。

二、主要特性

  • 输入正向电压 Vf:1.2 V(典型)
  • 最大正向电流 If:50 mA
  • 输出最大电流:50 mA
  • 直流反向耐压 Vr(LED 侧):6 V(不可长期反向施加)
  • 隔离耐压 Vrms:3.75 kV(输入与输出之间)
  • 负载电压(输出侧):最高 80 V
  • 集电极-发射极饱和电压 VCE(sat):100 mV(条件:If=20 mA, Ic=1 mA,按厂家标注)
  • 电流传输比 CTR:最小 80%,最大/饱和值可达 600%(CTR = Ic/If ×100%)
  • 上升/下降时间 tr / tf:约 4 µs / 3 µs(中速开关)
  • 工作温度范围:-55 ℃ ~ +110 ℃
  • 单通道,SOP-4 封装

三、关键参数说明(实用理解)

  • CTR(电流传输比)范围较宽(80%–600%),说明在相同 LED 电流下输出电流随器件批次和工作条件变化较大,设计时建议留有裕量或采用闭环/滞后设计以保证稳定性。
  • VCE(sat) 很低(100 mV),适合需要低压降的开关场合,但该数据是在特定 If / Ic 条件下测得,实际工况需参照数据手册。
  • 上升/下降时间在微秒级,适合中速数字信号隔离,不推荐用于高频精密脉冲(MHz 级)传输。
  • 隔离电压 3.75 kVrms 提供良好安全隔离能力,适合消费电子和多数工业应用的信号隔离需求。

四、应用建议与设计注意事项

  • LED 串联限流电阻计算:R = (Vcc – Vf) / If。举例:Vcc=5 V,目标 If=1 mA,则 R ≈ 3.8 kΩ;若 If=20 mA,则 R ≈ 190 Ω。
  • LED 反向耐压仅 6 V,建议在可能存在反向脉冲的电路中并联反向保护二极管或在 PCB 布线与电源管理上避免反向过压。
  • 由于 CTR 变动大,若对输出电流精度要求高,可采用恒流或检测反馈电路,或在输出侧使用集电极开路并配合下拉/上拉电阻实现稳定逻辑电平。
  • 考虑工作温度对 CTR 和导通特性的影响,环境温度高时输出可能下降,应在极端工况下做验证。

五、封装与可靠性

SOP-4 小体积封装便于表面贴装(SMT)生产和空间受限板级设计。器件适用温度范围宽,且隔离等级和 VCE(sat) 等关键参数适合工业级应用。在布局时应注意输入输出间保持足够的爬电距离及符合 EMC 与安全规范的间距要求。

总结:TLP181GB-S 提供低 VCE(sat)、高隔离电压和中等速度响应,适合需要电气隔离的数字或模拟信号传输场景。设计时重点关注 CTR 波动、LED 反向耐压与工作电流,以确保长期稳定可靠。

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