Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Brightking SMD1812B050TF/30 SMD1812B050TF
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Brightking SMD1812B050TF / 30
- Type
- BRIGHTKING
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Brightking
- Electronic Component
- SMD1812B050TF/30
- Electronic Component
- 1
- Electronic Component
- 3.41mm
- Package
- 1812
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.11g
- Electronic Component
- 4.73mm
- Electronic Component
- 2.1mm
- Electronic Component
- 1
- Electronic Component
- 150ms
- Electronic Component
- BM69415411
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 30V
- Power(Pd)
- 800mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：自恢复保险丝 SMD1812B050TF/30
一、概述
自恢复保险丝 SMD1812B050TF/30 是一款由台湾品牌 Brightking（君耀）制造的表面贴装型（SMD）保护器件。该产品设计用于在电流超过安全限制时保护电路免受损害，并具备自动复位功能，用户无需更换保险丝，降低了维护成本和增加了使用的便利性。
二、基本参数
- 封装类型：1812 (Metric 4532)
- 额定电流：500mA
- 额定电压：30V
- 工作温度范围：-40°C 到 +85°C
- 电气特性：自恢复特性，过载后自动恢复
- 引脚配置：典型的引脚配置适应于表面贴装技术
- 材料：通常使用高性能导电材料和绝缘基材
三、功能与应用
自恢复功能： 自恢复保险丝的核心特点是其能够在过载状态下熔断并在故障消失后自动复位。这一特性使得其适合用在多种电子设备中，尤其是在不易接近或难以维护的应用场合。例如，移动设备、家用电器、工业设备等。
应用场景：
- 移动设备：为智能手机、平板电脑等设备提供电路保护。
- 消费电子产品：用于保护电视、音响及其他家庭娱乐设备。
- 工业应用：在机器设备、电气驱动系统等中进行短路和过载保护。
- 汽车电子：在电动调节、LED灯光等车载电子设备中应用。
四、技术优势
- 小巧的封装设计：1812 封装面积较小，便于在空间受限的PCB上进行布线和贴装，同时不会影响设备的整体尺寸和重量。
- 高可靠性：采用优质的原材料生产，具有良好的抗热、抗湿性能，确保在不同环境条件下的可靠性。
- 低阻抗特性：在正常工作状态下，具备低的电阻特性，减少了功耗和发热，提升了系统效率。
五、选择指南
在选择自恢复保险丝时，设计工程师需考虑以下几个关键要素：
- 额定电流：确保选用的保险丝可以满足电路工作时的正常电流，同时具备足够的过载能力。
- 额定电压：确保保险丝的额定电压高于系统最大工作电压，以避免意外熔断。
- 工作温度范围：选择合适的温度等级，以符合设备可能面临的工作环境。
六、总结
SMD1812B050TF/30 自恢复保险丝是现代电子设备不可或缺的保护元件，其自动复位特性大幅简化了维护工作，提高了系统的可靠性和可用性。凭借小巧的尺寸、优质的制造材料和出色的电气性能，它在多个应用领域中展现了卓越的性能，成为了电子设计中值得信赖的安全保护方案。随着电子产品向小型化和智能化的发展，像 SMD1812B050TF/30 这样的元件将在市场中扮演更加重要的角色。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
