WMSIC Electronic Components

BHFUSE BSMD0603-010-33V BSMD0603

ModelBSMD0603-010-33V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-010-33V
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-010-33V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.036g
Electronic Component
1.85mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
600ms
Electronic Component
BM0225978015
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
33V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-010-33V 产品概述

一、产品简介

BSMD0603-010-33V 为 BHFUSE(佰宏)系列的一款微型表面贴装自恢复保险元件(PTC resettable fuse)。0603(约1.85×1.05×1.00 mm)封装,适用于电压不超过33V 的低功耗保护场合。器件在正常工作时保持低阻抗以保证最小压降,遇短路或过流时迅速增阻限流,故障解除后自动复位,便于电路重复保护。

二、主要技术参数

  • 尺寸(L×W×H):1.85 mm × 1.05 mm × 1.00 mm(0603)
  • 初始态阻值 Rmin:0.9 Ω(900 mΩ)
  • 跳断后阻值 R1max:8 Ω(最大)
  • 保持电流 Ihold:100 mA
  • 跳闸电流 Itrip:300 mA
  • 最大短时冲击电流 Imax:40 A(短脉冲承受能力)
  • 耐压 Vmax:33 V
  • 最大耗散功率 Pd:500 mW
  • 动作时间:典型 600 ms(与过流倍率及环境温度相关)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:0603 SMD,品牌:BHFUSE(佰宏)

三、性能与工作原理

该件属聚合物自恢复保险元件,常态下内部导体与聚合物呈低阻状态,允许正常电流通过;当电流超过器件热触发阈值(接近或超过 Itrip)时,器件内部升温使聚合物体积和导电路径发生变化,整体阻值上升至 R1max 量级,从而限制电流,保护下游电路。去除过流后温度回落,聚合物恢复,阻值回到初始态,器件重新导通。动作时间与过流幅度、环境散热条件密切相关,制造商提供的600 ms 为典型值。

四、典型应用场景

  • USB、OTG 端口及总线电源过流保护(5V~33V 范围内)
  • 便携式设备与物联网终端的电源保护
  • 电池管理与充电回路初级保护(需配合电路实际电压与浪涌评估)
  • 通信设备、仪器仪表的局部短路防护
  • 小型消费电子、模块化电源入口保护

五、选型与布板建议

  • 确保设备在正常工作时的电流远低于 Ihold(至少留有安全裕量),并且电路最大持续电流不超过 Pd/ Rmin 所能承受的热量。
  • Itrip 与实际启动浪涌(inrush)相比应有足够余量,避免因启动电流导致误跳。若启动浪涌接近 Itrip,考虑增加限流电阻或选择更高规格型号。
  • 放置位置建议靠近被保护电源入口或端口,减小保护元件对下游布线的影响;同时避免靠近热源或散热口,以免环境温度影响动作特性。
  • 采用标准回流工艺贴装,遵循供应商的焊接温度曲线与焊盘设计建议,避免过度机械应力和重复高温造成性能漂移。

六、注意事项与可靠性提示

  • 长时间或频繁跳闸会影响器件特性,应在设计中减少持续过载发生的可能性。
  • Imax 为短时脉冲能力,非持续允许电流;长时间超过 Ihold 会导致器件发热并进入高阻状态。
  • 在关键应用场合建议进行实际应用下的可靠性和热仿真验证,确认器件在目标环境(高温、封装密集、空气流动差等)下的动作与复位行为。
  • 购买与使用前请参阅 BHFUSE 官方数据手册,获取完整的测试条件、典型曲线与焊接工艺规范。

如需完整 datasheet、封装尺寸图或样品测试数据,可联系供应商或本公司技术支持获取进一步资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.