WMSIC Electronic Components

BHFUSE BSMD0603-002-60V BSMD0603

ModelBSMD0603-002-60V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-002-60V
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-002-60V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.026g
Electronic Component
1.85mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
1s
Electronic Component
BM0226580893
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
60V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-002-60V 自恢复保险丝 产品概述

BSMD0603-002-60V 是佰宏(BHFUSE)推出的一款0603封装自恢复保险丝(PolySwitch/PTC),专为空间受限的表面贴装电路设计。该器件在正常工作时呈低阻状态,当电路出现过流或短路故障导致电流超过跳闸电流(Itrip)时,器件阻值迅速上升以限制电流,通过自热维持高阻态保护电路;故障解除后随温度下降自动复位,可重复使用,适用于便携设备、通信模块、电源输入及信号线保护等场景。

一、主要规格与电气参数

  • 封装:0603(SMD)
  • 尺寸:长度 1.85 mm × 宽度 1.05 mm × 高度 1.00 mm
  • 初始态阻值(Rmin):12 Ω
  • 跳断后最大阻值(R1max):70 Ω
  • 工作电压最大值(Vmax):60 V
  • 跳闸电流(Itrip):60 mA(典型)
  • 保持电流(Ihold):20 mA(典型)
  • 最大短时冲击电流(Imax):20 A
  • 动作时间:1 s(在规定过流条件下)
  • 最大耗散功率(Pd):500 mW
  • 工作温度范围:-40 ℃ 至 +85 ℃

二、关键特性

  • 极小封装:0603 尺寸适合高密度贴装、节省 PCB 空间。
  • 可自恢复保护:发生过流后自动进入高阻态限制电流,故障解除后自动复位,无需更换。
  • 高频率重复动作能力:适用于偶发过流或短路情况的保护。
  • 宽电压支持:最高可承受 60 V,适配多种低中压系统。
  • 强冲击耐受:短时可承受高达 20 A 的浪涌电流,能保护瞬态故障。

三、典型应用场景

  • 移动设备及便携式电子产品的充电、电源输入保护。
  • 通信设备、模块化电路的信号线与供电轨保护。
  • 工业控制与测量设备的短路保护与过流限制。
  • 汽车电子辅助电路(在符合工作温度和浪涌条件下)。

四、选型建议

  • 若电路正常工作电流接近或超过 Ihold(20 mA),应选择保持电流更高的型号以避免误动作。
  • 对于需要更低初始阻值的场合,本型号 Rmin = 12 Ω 较高,应验证是否满足功耗与电压降要求。
  • 关注 Pd(500 mW)与环境温度,选择能在目标温度下安全散热的布局与器件。
  • 若系统存在频繁大电流浪涌,需评估器件能否承受并复位,或考虑并联其他保护元件。

五、封装与PCB布线建议

  • 按照0603标准焊盘布局,推荐使用热阻控制的焊盘以保证良好回流焊接。
  • 为降低功率热积聚,周围避免紧密密集放置高发热器件,必要时采用散热铜箔。
  • 焊接建议遵循供应商推荐的回流温度曲线,避免过高温度和多次高温循环。

六、安装与使用注意事项

  • 避免在高湿环境或存在腐蚀性气体环境中长期使用,或使用防护涂层。
  • 不建议在超过额定工作温度的环境中长时间工作,否则会影响动作特性与寿命。
  • 测试时请确认测量电路不会触发器件自保护(例如测试测量电流不超过 Ihold)。

七、可靠性与环境耐受

  • 工作温度范围宽,适用于多种工业与民用场合。
  • 建议在实际应用前进行温升、反复动作测试与寿命评估,特别是在频繁过流或高温环境下。

八、包装与供应

  • 常见为卷带(Reel)包装,适合贴片机自动化贴装。
  • 采购时请确认批次与规格一致,并索取完整规格书与可靠性数据。

以上为 BSMD0603-002-60V 的产品概述与实用建议。在设计保护电路时,请结合具体应用工况(工作电流、峰值冲击、环境温度与散热条件)进行详细验证。若需器件详细曲线、回流焊工艺参数或样品测试数据,可联系供应商获取规格书与样品支持。

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