WMSIC Electronic Components

BHFUSE BSMD0805-050-24V BSMD0805

ModelBSMD0805-050-24V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-050-24V
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-050-24V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.023g
Electronic Component
2.2mm
Electronic Component
1.1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0225977996
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-050-24V 产品概述

一、产品简介

BSMD0805-050-24V 是佰宏(BHFUSE)推出的一款0805封装表面贴装自恢复熔断器(PTC/聚合物基复合保护器件),针对24V系统中的过流和短路保护设计。该器件在正常工作电流下维持低阻抗、在异常过流时迅速升温增阻以限制电流,故障消除后可自动冷却恢复,适用于电源总线、模块输入保护及各类工业、通信及消费类电子设备。

二、主要参数

  • 工作温度范围:-40℃ ~ +85℃
  • 额定电压(Vmax):24V
  • 保持电流(Ihold):500mA
  • 跳闸电流(Itrip):1A
  • 最大电流(Imax,浪涌):40A
  • 初始态阻值(Rmin):100mΩ
  • 跳断后阻值(R1max):850mΩ
  • 功耗(Pd):600mW
  • 动作时间(典型):100ms
  • 尺寸(封装0805):长度 2.2mm × 宽度 1.5mm × 高度 1.1mm
  • 品牌:BHFUSE(佰宏)

三、特性与优势

  • 复位型保护:在过流或短路后可自动恢复,无需更换熔断器,降低维护成本。
  • 小尺寸封装:0805 封装便于高密度PCB布线和自动贴装,适配常见SMT产线。
  • 宽温工作:-40℃至+85℃,适合多种环境和工业应用。
  • 快速动作:典型动作时间约100ms,能在较短时间内限制事故电流。
  • 高浪涌承受:40A 的最大短时承受能力,适合容忍启动或瞬态浪涌的场景。
  • 低初始阻值:100mΩ 的低导通电阻在正常运行时可最大限度降低功耗和热量。

四、应用场景

  • 24V 工业控制与自动化设备电源保护
  • 通信设备与基站供电输入保护
  • 汽车电子(非直接安全关键回路)与车载辅助系统
  • 电源模块、DC-DC 转换器输入侧保护
  • 电池管理与充电系统的过流防护(需结合系统要求评估)

五、设计与使用建议

  • 选择原则:保持电流(Ihold)应高于设备最大稳定工作电流,通常留有安全裕量;若系统工作电流接近500mA,应考虑提升裕量或选型更高Ihold等级。
  • 布局建议:为提高热量散发,应避免将器件完全包围在高元件密度区,必要时配合铜箔散热或采用通孔散热过孔。
  • 功耗与热管理:器件Pd为600mW,长期工作时应保证环境温度和PCB热阻使实际功耗不超过其热允许值。高温环境需注意热降额。
  • 浪涌与重复故障:Imax 40A 代表短时脉冲承受能力,非长期工作电流。若应用存在频繁大幅浪涌,应评估器件寿命并考虑并联或选型更耐冲击的保护器件。
  • 焊接与工艺:0805 SMD 封装兼容常规回流焊工艺,建议遵循制造商回流曲线和湿储存/烘烤要求,避免过热导致性能退化。

六、性能验证与可靠性

出厂前通常进行温升、动作时间、保持/跳闸电流及多次循环测试以验证一致性。用户在设计阶段应做实际工况下的热仿真和样机试验,包含短路持续时间评估、重复触发寿命测试以及在高低温环境下的特性验证,确保在目标环境中满足保护要求。

七、选型与采购建议

  • 型号 BSMD0805-050-24V 明确了额定电压24V与保持电流500mA的设计指标。若系统电流或环境温度超出该器件能力,请优先选用更高 Ihold 或更高 Pd 等级的产品。
  • 采购前请索取并核对佰宏官方数据手册,关注典型曲线(I-T、I-P、R-T)、回流焊接条件及可靠性测试数据。如需样品或批量采购,可联系佰宏授权代理或经销商获取技术支持与认证资料。

如需针对具体电路的选型建议、热仿真支持或替代型号比对,可提供工作电压、典型工作电流及环境信息,以便给出更精准的应用方案。

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