Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Bencent BS4200N-C-F BS4200N
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Bencent BS4200N-C-F
- Type
- BENCENT
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BENCENT
- Electronic Component
- BS4200N-C-F
- Electronic Component
- 1
- Package
- SMB-F
- Electronic Component
- Thyristor Surge Suppressor (TSS)
- Electronic Component
- 0.136g
- Current
- 5uA
- Electronic Component
- 1
- Electronic Component
- BM0264981157
- Operating Temperature
- 40℃~+150℃
- Latching Current(Ih)
- 50mA
- Switch Voltage(Vs)
- 520V
- Capacitor(Co)
- 35pF
- Voltage(Vt)
- 4V
- Current(It)
- 2.2A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BS4200N-C-F 产品概述
一、产品简介
BS4200N-C-F为Bencent（槟城）推出的高能量瞬态电压抑制器（TVS），SMB-F封装，专为以太网及通信接口的浪涌保护设计。器件具有快速响应、高吸收能量能力和非退化特性，能在瞬态事件中有效钳制过电压，保护后端敏感电路。
二、主要参数
- 断态峰值电压 (Vdrm)：400 V
- 开关电压 (Vs)：520 V
- 通态电压 (Vt)：4 V（It = 2.2 A）
- 通态电流 (It)：2.2 A
- 峰值脉冲电流 (Ipp)：150 A
- 漏电流：5 μA
- 保持电流 (Ih)：50 mA
- 断态电容 (Co)：35 pF
- 工作温度范围：-40 ℃ ~ +150 ℃
- 湿度敏感度等级：1 级
- 重量：约 87 mg
- 封装：SMB-F（表面贴装）
以上参数为器件典型值/额定值，具体性能应参考厂家数据手册中的测试条件。
三、关键特性
- 出色的瞬态浪涌吸收能力，能承受高达150 A的峰值脉冲电流，适用于雷电或开关瞬变等冲击场景。
- 对上升快的浪涌电压具有快速响应特性，可在极短时间内钳位过电压，降低对下游电路的冲击。
- 低漏电流（5 μA），在正常工作条件下不会对线路造成明显额外功耗或偏置影响。
- 断态电容仅35 pF，减少对高速差分信号（如以太网）传输特性的影响。
- 非退化性设计，重复浪涌冲击后性能稳定，可靠性高。
- 湿敏度等级为1级，存储和贴片过程中无需特殊烘烤处理。
四、典型应用与布局建议
- 主要用于以太网接口（包括10/100/1000BASE-T）、通信接口和其他要求高速信号保护的网络设备。
- 建议将器件靠近RJ45等外部接口放置，尽量缩短信号回路与寄生阻抗，以提高保护效果。
- 对差分信号对的保护，可将器件并联于信号对之间或信号对到地之间，具体接法按系统地线方案选择。
- SMB-F封装方便自动贴片与回流焊接，适用于批量SMT工艺。
五、使用注意事项
- 设计时请核对系统最大工作电压与Vdrm、Vs等参数，确保器件处于合适的工作和保护区间。
- 在选择保护拓扑时注意信号完整性要求，断态电容虽小但仍可能对千兆速率有影响，必要时进行信号完整性仿真。
- 维护与存储按湿度敏感度1级管理，常规ESD及焊接保护措施需到位。
- 在高能量应用场合，配合熔断保护或限流措施可提高系统整体可靠性。
六、封装与采购参考
- 封装形式：SMB-F（表面贴装）
- 重量：约87 mg
- 品牌：Bencent（槟城）
如需样品或批量采购，请提供具体使用场景和所需数量，以便获取最新的器件数据手册与交付信息。
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