WMSIC Electronic Components

ElecSuper ESD5451X-ES ESD5451X

ModelESD5451X-ES
PackageDFN1006-2L
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super ESD5451X-ES
Type
ELECSUPER
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
ESD5451X-ES
Electronic Component
1
Package
DFN1006-2L
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.012g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
10pF
Electronic Component
BM0230658589
Operating Temperature
40℃~+125℃
Voltage
10V
Electronic Component
IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD5451X-ES 产品概述

一、产品简介

ESD5451X-ES 是 ElecSuper(静芯微)推出的一款单路双向瞬态电压抑制器(ESD保护器件),专为 5V 及同等级信号线的静电放电与浪涌保护设计。器件在小型 DFN1006-2L 封装内集成高效钳位性能与低寄生电容,适合空间受限且对信号完整性有要求的现代电子设备。

二、主要电气参数

  • 极性:双向(双向对称钳位,适合互联信号线)
  • 反向截止电压 Vrwm:5V
  • 击穿电压 Vbr:6V(典型)
  • 钳位电压 Vc:10V(在 Ipp 条件下)
  • 峰值脉冲电流 Ipp:6A
  • 峰值脉冲功率 Ppp:60W(厂方脉冲条件)
  • 反向电流 Ir:1µA(在 Vrwm 条件下)
  • 结电容 Cj:10pF(低电容设计,利于高速信号)
  • 通道数:单路;工作温度范围:-40℃ ~ +125℃
  • 防护等级:满足 IEC 61000-4-2 静电放电测试要求

三、典型应用场景

  • USB、GPIO、串口、I2C/SPI 等 5V 及低压高速数据线的ESD保护
  • 手机、手持终端、可穿戴设备、消费电子产品的外部接口防护
  • 工业控制与通讯设备中需要单通道保护且空间受限的场合

四、封装与布局建议

DFN1006-2L 超小封装(约 1.0 × 0.6 mm)节省电路板空间、降低引线电感。建议布局要点:

  • 保护器件距离被保护器件引脚尽量短,焊盘与走线缩短以降低寄生电感;
  • 器件接地回路应设计为低阻抗、短距离的地线或单点回流到地平面;
  • 对于敏感高速线,考虑在保护器件前端加入小电阻或共模元件以优化浪涌分流和信号完整性。

五、设计注意事项

  • Vrwm 为 5V,适用于 5V 及更低电压系统,若用于更高直流电压系统需选型更高 Vrwm 的器件;
  • 钳位电压 10V 为冲击时的保护电平,仍需评估被保护器件的承受能力;
  • 峰值功率和脉冲电流受脉冲波形与重复率影响,长期或高能脉冲场景需做热与寿命评估。

六、产品优势与总结

ESD5451X-ES 以其双向保护、低漏电、低结电容与小型封装,在保证 IEC61000-4-2 级别静电防护的同时,对高速信号影响小、适配空间受限设计。对 5V 应用场景提供可靠且成本效益高的防护解决方案,是现代便携与工业电子外部接口防护的理想选择。若需更高通道数或不同 Vrwm 的变体,可联系厂商获取系列产品资料与评估样品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.