WMSIC Electronic Components

ElecSuper ESD9X5VU-ES ESD9X5VU

ModelESD9X5VU-ES
PackageDFN1006-2L
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super ESD9X5VU-ES
Type
ELECSUPER
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
ESD9X5VU-ES
Electronic Component
1
Package
DFN1006-2L
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.011g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.5pF
Electronic Component
BM0264576552
Voltage
15V
Electronic Component
IEC 61000-4-2
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD9X5VU-ES 产品概述

一、产品简介

ESD9X5VU-ES 是 ElecSuper(静芯微)推出的一款单路、单向高性能静电放电防护器件,专为超高速接口和敏感射频线路的瞬态过压防护设计。该器件标称工作电压 Vrwm = 5V,采用小型 DFN1006-2L 封装,结电容仅 0.5 pF,非常适合 HDMI、USB、NFC、RF 天线及其他高速数据/射频通道的防护应用。器件按 IEC 61000-4-2 标准可承受高达 20 kV 的电磁静电放电能力,为系统提供可靠的 ESD 防护。

二、主要电气参数(典型/标称)

  • 类型:ESD,单路单向保护
  • 反向截止电压 Vrwm:5 V
  • 击穿电压 VBR:6 V(典型)
  • 钳位电压(Ipp 下):15 V(峰值钳位)
  • 峰值脉冲电流 Ipp:4 A
  • 反向漏电流 Ir:1 μA(在 Vrwm 条件下)
  • 结电容 Cj:0.5 pF(低电容,利于高速信号)
  • 通道数:单路
  • 防护等级:符合 IEC 61000-4-2(测试至 20 kV)
  • 封装:DFN1006-2L(小尺寸、低剖面)

以上参数使 ESD9X5VU-ES 在保证防护能力的同时,最大限度地减少对高速信号完整性的影响。

三、产品特点与优势

  • 低结电容(0.5 pF):对 GHz 级别或高速差分信号的影响最小,适合 HDMI、USB3.x、SATA、LVDS、RF 天线等应用场景。
  • 单向保护:在通常工作电压下呈高阻状态,避免对信号线造成直流偏置干扰;当出现瞬态过压时快速导通,将能量引导至地。
  • 高 ESD 耐受能力:满足 IEC 61000-4-2 测试,能承受高达 20 kV 的静电冲击,适合外露接口和容易遭受静电的终端设备。
  • 紧凑封装:DFN1006-2L 占板面积小,适合空间受限的移动设备、可穿戴设备和消费电子产品。
  • 低漏电流:Ir = 1 μA,有利于低功耗系统及对漏电流敏感的模拟/射频前端电路。

四、典型应用场景

  • HDMI、MHL、DisplayPort 等视频接口的保护;
  • USB 2.0 / USB 3.x 接口(尤其是高速线对)防护;
  • NFC、蓝牙、Wi‑Fi、GPS 等无线射频输入/输出端口;
  • 智能手机、平板、笔记本、可穿戴设备等外露接口;
  • POS 机、工业控制面板、医疗仪器等需要高可靠 ESD 防护的设备。

五、布局与使用建议

  • 就近布置:将器件靠近可能遭受静电的外部连接器(如 USB/HDMI 口)放置,以缩短信号线到器件的长度,减小串联感性与寄生阻抗。
  • 接地处理:地端应采用最短、最宽的回流路径接至系统地(GND),必要时使用多条小孔(vias)实现低感抗接地。
  • 与差分/高速线配合:对差分线应保证两路对称放置,若为差分对保护,可在每个线对上各自配置一只 ESD9X5VU-ES 或采用差分结构的防护方案以保持信号完整性。
  • 序列元件配合:在某些高能量环境中,可在信号线与保护器件之间并联或串联配合限流电阻、滤波器以降低钳位能量并优化开关特性。
  • 温度与焊接:遵循 DFN1006-2L 封装的回流焊接工艺规范,避免过高温度和过长时间的高温暴露以保护器件可靠性。

六、总结

ESD9X5VU-ES 以其低结电容、低漏电、高 ESD 抗扰能力及超小封装,在高密度、超高速接口的静电防护应用中具备明显优势。它既能在常态下保持对信号的高保真传输,又能在瞬态冲击到来时提供可靠的能量钳位和泄放,是保护 HDMI/USB/NFC/RF 等接口的理想选择。对要求体积小、性能高且对信号完整性敏感的设计,推荐将 ESD9X5VU-ES 纳入前端保护方案。

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