WMSIC Electronic Components

Nationstar NCD0603W1-XA NCD0603W1

ModelNCD0603W1-XA
Package0603
BrandPhotoelectric
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Photoelectric NCD0603W1-XA
Type
Nationstar
Minimum package
4000 卷

Technical parameters

Power
72mW
Electronic Component
Photoelectric
Electronic Component
NCD0603W1-XA
Electronic Component
1
Package
0603
Electronic Component
LEDDiode / LED
Electronic Component
0.023g
Electronic Component
1
LED
1.2cd
LED
130°
LED
Electronic Component
Electronic Component
BM0257395319
Operating Temperature
30℃~+85℃
Current
20mA
Electronic Component
Electronic Component
Diode
Diode

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCD0603W1-XA 产品概述

一、产品简介

NCD0603W1-XA 是国星光电推出的一款高亮白光贴片 LED,封装为常见的 0603(1608 米制)规格,适用于空间受限且需较高可视性的小型指示与背光场合。器件为独立二极管结构,便于阵列或单灯驱动设计。

二、主要电气与光学参数

  • 发光颜色:白色
  • 正向压降(Vf):典型 3.1 V(20 mA 时)
  • 正向电流(If):额定 20 mA
  • 最大功率:72 mW(器件额定)
  • 额定发光强度:1200 mcd(20 mA)
  • 发光角度:130°(宽视角)
  • 工作温度范围:-30 ℃ ~ +85 ℃
  • 封装与载带方式:0603 正贴(SMD)
    说明:在 20 mA 驱动下的实际耗散功率约为 3.1 V × 20 mA ≈ 62 mW,低于器件额定最大功率,有利于长期可靠性。

三、封装与焊接建议

0603 尺寸小,贴装时应采用与元件尺寸匹配的 PCB 焊盘和合理的焊膏开孔比例(常见 60%–80%),以降低“翘脚”现象。回流焊应遵循无铅回流工艺规范并参考厂商提供的回流曲线,避免超过器件最高允许温度和超时暴露。贴装时注意承力与搬运,避免端面压痕。

四、驱动与使用建议

  • 常用串联限流电阻计算举例:
    • 5 V 电源下 R ≈ (5.0 − 3.1) / 0.02 ≈ 95 Ω,常取 100 Ω;
    • 3.3 V 电源下 R ≈ (3.3 − 3.1) / 0.02 ≈ 10 Ω(余量小,建议采用恒流驱动或降压方案)。
  • 为保证色温一致性与亮度稳定,推荐恒流驱动或采用 PWM 调光(频率避免可见闪烁)。
  • 在高温环境或并联多颗时应进行降额处理,减少正向电流或增加散热,以延长寿命。

五、典型应用

适用于各类电子产品指示灯、手持设备指示、面板指示、家电按键背光、小型信号灯与穿戴设备等需要白光且封装尺寸受限的场合。

六、储存与可靠性提示

建议干燥存储并按厂商建议的防潮等级处理(若为吸湿敏感元件,开卷后应按回流前烘烤要求处理)。装配与测试过程中注意 ESD 防护,避免静电损伤。出于可靠性考虑,上限温度与最大功率下长期工作需谨慎评估。

结语:NCD0603W1-XA 在体积极小的前提下提供较高亮度与宽视角,适合空间受限的高频使用场景。最终设计请结合厂方完整数据手册并在目标系统中进行实测验证。

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