WMSIC Electronic Components

HGSEMI AT24C02CM/TR AT24C02CM

ModelAT24C02CM/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI AT24C02CM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
AT24C02CM/TR
Electronic Component
1
Package
SOP-8
Electronic Component
EEPROM
Electronic Component
0.233g
Electronic Component
1
Features
Built-in positions(POR)
Electronic Component
BM0226614578
Electronic Component
2Kbit
Operating Temperature
40℃~+105℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
200
Clock Frequency(fc)
1MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT24C02CM/TR 产品概述

一、产品简介

AT24C02CM/TR 是 HGSEMI(华冠)推出的一款 2Kbit 串行 EEPROM,采用标准 I2C 接口,适用于对非易失性数据存储有长期可靠性要求的嵌入式系统与消费电子产品。器件封装为 SOP-8,工作电压范围宽(1.7V ~ 5.5V),工作温度 -40℃ ~ +105℃,在苛刻环境下仍能保持稳定的数据保存能力与较长的寿命。

二、主要参数(基础规格)

  • 存储容量:2 Kbit(256 字节)
  • 接口类型:I2C(支持最高时钟频率 fc = 1 MHz)
  • 工作电压:1.7 V ~ 5.5 V
  • 工作温度:-40℃ ~ +105℃
  • 数据保持(TDR):200 年(典型器件长期数据保持能力)
  • 擦/写寿命:写周期寿命 2,000,000 次(典型)
  • 单次写周期时间(Tw):3 ms(字节/页写入完成所需时间)
  • 封装:SOP-8(散装或 /TR 卷带形式供货)

三、功能特点

  • I2C 串行接口,简化主控与外设互联,适配主流 MCU/MPU 总线
  • 宽电压供电,便于多电平系统兼容与电池供电应用
  • 高耐久度写周期与超长数据保持(适合需长期保存设置信息或校准数据的应用)
  • 支持快速写入与读出,1 MHz 时钟下可实现高速通信(注意总线负载与上拉电阻影响)
  • 写保护引脚(WP)支持硬件保护,防止误写

四、典型引脚与接口注意事项

(以下为通用说明,具体引脚定义请参见厂商数据手册)

  • 电源与接地:VCC、GND
  • I2C 信号:SDA(数据),SCL(时钟)
  • 地址/配置:器件可能带有 A0/A1/A2 等地址引脚或采用固定地址;请参考器件版本说明确定从地址编码
  • 写保护:WP 管脚可连接到高/低电平实施写保护
  • 建议在 SDA/SCL 上使用外部上拉电阻(Rpull-up),常用 4.7 kΩ 起,需根据总线电容、传输速率调整

五、设计与使用建议

  • 写入优化:采用页写(page write)方式可以显著提高写入效率并降低总线占用;页大小请参照详细数据手册。写操作后应使用器件忙检测或等待 Tw(3 ms)以确保写入完成。
  • 电源完整性:在 VCC 与 GND 之间并联去耦电容(例如 0.1 μF)以保证瞬态稳定性,尤其在高频 I2C 通信时。
  • 上拉电阻选择:总线电容大时适当减小上拉电阻值以满足上升时间要求,但要考虑电流消耗。
  • 写保护策略:对关键配置或校准数据,配合 WP 管脚与软件策略可实现更可靠的数据保护。
  • 温度与可靠性:器件支持工业级温度范围,适合汽车电子、工业控制等高温或低温环境,但长期暴露在极端环境时建议进行系统级验证。

六、典型应用场景

  • 配置与校准数据存储:仪表、传感器、智能模块的参数与校准表
  • 系统启动参数与序列号保存:嵌入式系统的启动配置、唯一识别码保存
  • 日志与统计数据:小容量的事件计数或状态记录
  • 消费电子与工业控制:设置记忆、用户偏好保存、电池供电设备中的关键数据保存

七、可靠性与封装

AT24C02CM/TR 提供 SOP-8 封装并可按需提供卷带(/TR)出货,适合贴片自动化生产。器件在规范使用条件下具有极高的数据保持能力(TDR 200 年)和写入耐久度(200 万次),适合需长期保存且频繁更新少量数据的应用场合。

八、采购与资料建议

  • 型号后缀 /TR 通常表示卷带包装(请与供应商确认具体包装与最小订购量)。
  • 在设计前请务必参照 HGSEMI 官方数据手册,确认引脚排列、页大小、器件地址编码与时序详细规范。
  • 若在高速(接近 1 MHz)或长总线环境下使用,建议与供应商或参考设计工程师讨论上拉电阻、终端匹配及 PCB 布线注意事项。

如需,我可以帮您梳理典型的硬件连接图、I2C 通信时序流程或比对同类 2Kbit EEPROM 的差异,便于在系统中做选型与设计决策。

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