WMSIC Electronic Components

HGSEMI CD4094BM/TR CD4094BM

ModelCD4094BM/TR
PackageSOP-16
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI CD4094BM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
to
Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
CD4094BM/TR
Electronic Component
1
Package
SOP-16
Electronic Component
positions Register
Electronic Component
4000B
Electronic Component
0.314g
Electronic Component
1
Features
Output
Electronic Component
BM0228150903
Operating Temperature
40℃~+85℃
Operating Voltage
3V~15V
Output Type
Electronic Component
Clock Frequency(fc)
3MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CD4094BM/TR 产品概述

CD4094BM/TR(品牌:HGSEMI 华冠)是一款属于4000B系列的8位串行转并行移位寄存器,采用SOP-16封装,工作电压范围宽(3V ~ 15V),工作温度为 -40℃ 至 +85℃,输出支持三态控制,适合在多种数字接口与总线系统中做串行数据扩展与并行驱动。器件在典型负载(50pF)与15V电源下的传播延迟为 tpd = 135ns,典型时钟工作频率可达 3MHz。

一、功能简介

CD4094BM/TR 将串行输入数据按时钟移入内部移位寄存器,并通过并行输出口提供并行数据驱动能力。器件支持输出三态,使得多个器件可共享同一并行总线,便于级联扩展或多点驱动控制。其大电压工作窗(3V~15V)使之既能兼容低压单片机系统,也可在较高电压环境下提升噪声容限与驱动能力。

二、关键电气特性

  • 工作电压:3V ~ 15V(宽电源范围)
  • 时钟频率(参考):3MHz(典型可用频率)
  • 输出类型:三态输出(便于总线共享)
  • 传播延迟:tpd = 135ns @ 15V, 50pF(用于估算时序裕量)
  • 工作温度:-40℃ ~ +85℃
  • 系列:4000B 系列
  • 封装:SOP-16

三、典型应用场景

  • LED 或数码管驱动的串行扩展(减小MCU引脚占用)
  • 多路并行输出控制(按键矩阵、继电器驱动前端)
  • 总线共享环境的输出缓冲与选通
  • 需要级联扩展的移位链路(多个CD4094串联以增加位数)
  • 工业控制与汽车电子等宽温环境应用

四、使用要点与设计建议

  1. 电源与去耦:为保证时序稳定与抑制瞬态,靠近芯片的VCC与GND引脚处并联0.1µF陶瓷电容以及1µF~10µF的电解/固体电容,尤其在较高供电电压下更为重要。
  2. 负载与延迟:给定的tpd是在50pF负载下测得,增大输出负载会增加延迟并降低上升/下降速率。设计时应尽量减小输出负载或使用缓冲器以满足高速时序。
  3. 三态使用:三态控制信号应避免在无定义状态下同时让多个器件驱动总线(总线冲突),切换时提供适当延时,确保总线稳定。
  4. 级联扩展:在多片级联时注意时钟与锁存(若使用)关系,保证移位链的数据完整性;建议使用门控信号对链路进行分段控制以减少瞬态供电干扰。
  5. 电平兼容:器件支持宽电压,但接口到低压MCU时应确认信号电平兼容或采用电平移位措施。

五、封装与采购信息

  • 品牌:HGSEMI(华冠)
  • 型号:CD4094BM/TR
  • 封装形式:SOP-16(适合自动贴装与手工焊接)
  • 环境等级:工作温度 -40℃ ~ +85℃,适用于工业级应用

总结:CD4094BM/TR 是一款应用广泛、工作电压宽、支持三态输出的移位寄存器,适合做串行转并行扩展及总线驱动。在高速或大负载场合需关注输出负载与传播延迟,并做好电源去耦与三态控制以保证系统可靠性。若需更详细的引脚定义、时序图或典型接线图,可参考华冠提供的完整数据手册以进行精确设计。

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