Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HGSEMI LM4871BM/TR LM4871BM
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI LM4871BM / TR
- Type
- HGSEMI
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HGSEMI
- Electronic Component
- LM4871BM/TR
- Electronic Component
- 1
- Package
- SOP-8
- Electronic Component
- Audio Power Amplifier
- Electronic Component
- 0.241g
- Electronic Component
- 1
- Features
- Electronic Component
- Electronic Component
- BM0227677194
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2V~5V
- Output Power
- 2.5Wx1@4Ω；3Wx1@3Ω；1.5Wx1@8Ω
- Static Current(Iq)
- 6.5mA
- Speaker Channel Count
- Electronic Component
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM4871BM/TR 产品概述
一、产品简介
LM4871BM/TR 为 HGSEMI（华冠）推出的一款单声道音频功率放大器，封装为 SOP-8。器件工作电压范围宽（2V~5V），面向便携式音频、蓝牙音箱、手持设备和低功耗扬声器驱动等应用场景。该器件在不同负载阻抗下可提供多档输出功率，能满足从耳机到小型外放的多种需求。
二、主要规格参数
- 扬声器通道数：单声道
- 输出功率：3W ×1 @3Ω；2.5W ×1 @4Ω；1.5W ×1 @8Ω
- 工作电压：2V ~ 5V
- 总谐波失真+噪声（THD+N）：0.25%
- 静态电流（Iq）：6.5mA
- 电源纹波抑制比（PSRR）：60dB
- 工作温度范围：-40℃ ~ +85℃
- 品牌：HGSEMI（华冠）
- 封装：SOP-8
三、核心特性与优势
- 低电压工作：2V~5V 的宽电源电压使其能直接与单节锂电池或常见移动电源配合使用，便于便携设备设计。
- 多档输出能力：器件在 3Ω、4Ω、8Ω 不同负载上均能稳定输出，灵活匹配扬声器阻抗。
- 低失真与良好信噪比：THD+N 典型为 0.25%，结合 60dB 的 PSRR，可在弱电源环境下获得较干净的音频输出，保证音质表现。
- 低静态功耗：6.5mA 的静态电流有利于延长电池供电的续航时间。
- 宽温度覆盖：-40℃ 至 +85℃ 的工作温度保证器件在工业级或户外环境下的可靠性。
四、典型应用场景
- 便携式蓝牙音箱与手持音响
- 移动设备外放（平板、智能终端）
- 玩具与教育类电子产品音频驱动
- 简易有源扬声器与多媒体外设
五、设计与使用建议
- 电源去耦：建议在电源引脚附近并联 0.1µF 微型陶瓷电容与 4.7µF~10µF 电解或钽电容，以抑制高频纹波并提升低频稳定性，充分发挥 60dB PSRR。
- 布局与接地：输出与电源走线尽量短且粗，模拟地与电源地良好连接，必要时采用地平面以降低噪声耦合。
- 散热考虑：在高输出功率或低阻抗负载（如 3Ω）下，应关注封装温升，必要时优化 PCB 铜箔面积以提高散热能力。
- 扬声器匹配：根据所需声压与系统电源能力，选择合适阻抗扬声器，避免长期在额定极限输出下工作以延长器件寿命。
- 可靠性设计：若系统需更高鲁棒性，可在输出端增加简单的限流或短路保护电路，并遵循器件 datasheet 中的热特性与最大额定值。
六、封装与采购信息
LM4871BM/TR 提供 SOP-8 封装，适合自动贴装与中等密度 PCB 布局。生产与选型时请参考华冠官方资料与样片验证，确保参数与系统需求一致。
总结：LM4871BM/TR 是一款面向便携与低功耗音频输出场景的单声道功放器件，凭借宽电源电压、较高的输出功率和低失真特性，适合多种消费电子与嵌入式音频应用。实际设计时请结合具体 PCB 布局、散热与电源管理做综合优化。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
