Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HGSEMI HG74HC595LQ/TR HG74HC595LQ
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI HG74HC595LQ / TR
- Type
- HGSEMI
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- to
- Electronic Component
- Electronic Component
- Electronic Component
- HGSEMI
- Electronic Component
- HG74HC595LQ/TR
- Electronic Component
- 1
- Package
- QFN-16(3x3)
- Electronic Component
- positions Register
- Electronic Component
- 74HC
- Electronic Component
- 0.18g
- Electronic Component
- 1
- Features
- Output
- Electronic Component
- BM0264801303
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 3.2V~5.5V
- Output Current
- 35mA
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HG74HC595LQ/TR 产品概述
一、产品简介
HG74HC595LQ/TR 是一款来自 HGSEMI（华冠）的 8 位 CMOS 串行入并行出移位寄存器，属于 74HC 系列。器件提供串行数据输入、移位时钟与锁存时钟，可将串行数据转换为并行输出，适用于 GPIO 扩展与驱动多路负载场景。
二、主要参数
- 工作电压：3.2 V ～ 5.5 V
- 时钟频率 (fc)：最高 10 MHz（典型系统时序受负载与走线影响）
- 传播延迟 (tpd)：100 ns @5V, CL=50 pF；50 ns @5V, CL=50 pF（不同路径/动作下典型值）
- 输出类型：三态（可通过输出使能控制）
- 输出电流：±35 mA（单输出极限，实际应用按热与电流限制）
- 功耗 (Pd)：最大 500 mW
- 工作温度：-40 ℃ ～ +85 ℃
- 封装：QFN-16（3×3 mm）
- 特殊功能：异步清零（CLR）、输出使能（OE）
- 系列：74HC
三、功能特性
- 8 位并行输出，支持锁存功能，实现数据同时更新。
- 三态输出允许多片级联或总线共享，便于系统扩展。
- 异步清零可在任意时刻将寄存器输出置零，便于快速复位。
- 低功耗 CMOS 设计，适合电池供电与工业级应用。
四、封装与物理特性
- QFN-16（3×3 mm）紧凑封装，适合空间受限的表贴设计。
- TR 表示卷带包装（Tape & Reel），便于自动贴片生产。
五、典型应用
- 单片机 GPIO 扩展（LED、指示灯、键盘行列驱动）
- LED 灯阵与数码管驱动（需并联驱动器或限流保护）
- 多路继电器/开关控制（注意电流与隔离）
- 总线式输出控制与数字逻辑级联
六、使用要点与建议
- 上电与时钟输入应先稳定电源并加旁路电容（0.1 µF），以保证时序稳定。
- 输出驱动大负载时注意功耗与结温，避免超过 Pd 与单脚最大电流限制；必要时并联缓冲驱动器。
- OE、CLR 等控制信号需有明确上拉/下拉，避免悬空引起误动作。
- 串接多片使用时注意级联传播延迟与时序裕量，保证锁存与移位时钟的相对关系正确。
- 在高速或较大负载场合，留意 PCB 布线与阻抗匹配以降低信号完整性问题。
HG74HC595LQ/TR 以其小尺寸、三态输出与异步清零等实用特性，适合嵌入式系统中进行高密度 I/O 扩展与并行驱动场景。订购时请选择适合的封装与卷带选项以配合生产需求。
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