WMSIC Electronic Components

HGSEMI 74HC595M/TR 74HC595M

Model74HC595M/TR
PackageSOP-16
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI 74HC595M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
to
Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
74HC595M/TR
Electronic Component
1
Package
SOP-16
Electronic Component
positions Register
Electronic Component
74HC
Electronic Component
0.316g
Electronic Component
1
Features
Output
Electronic Component
BM0264462403
Operating Temperature
40℃~+85℃
Operating Voltage
3.2V~6V
Output Current
35mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74HC595M/TR(HGSEMI 华冠)产品概述

一、产品简介

74HC595M/TR 为 HGSEMI(华冠)推出的 74HC 系列 8 位串行入并行出移位寄存器,具有并行输出三态控制功能,适用于 IO 扩展、数码管/LED 驱动、灯光阵列与微控制器外设接口等场景。器件采用 SOP-16 封装,TR 表示卷带(Tape & Reel)包装,便于 SMT 贴片生产。

二、主要特性

  • 功能:串行至并行(8 位)移位寄存器,带锁存与三态输出。
  • 工作电压:3.2 V ~ 6.0 V,兼容 3.3V 与 5V 系统。
  • 时钟频率 (fc):典型可达 10 MHz(受负载及走线影响)。
  • 输出类型:三态(便于总线级联与输出隔离)。
  • 每元件位数:8 位;可级联扩展更多位宽。
  • 工作温度:-40 ℃ ~ +85 ℃(工业级)。
  • 品牌/型号:HGSEMI(华冠) 74HC595M/TR。
  • 封装:SOP-16。

三、关键电气参数

  • 传播延迟 tpd:100 ns(在 5 V、CL=50 pF 测试条件下)。
  • 最大耗散功率 Pd:500 mW。
  • 输出驱动能力:单端输出电流可达 35 mA(请按实际工作点评估温升与容限)。

四、典型应用与使用建议

  • 常用于 MCU/FPGA 的 IO 扩展、LED 驱动、指示灯控制与串并转换场景。
  • 可通过级联多个器件扩展位数,使用锁存(RCLK)将移位寄存器内容并行输出。
  • 建议在 VCC 与 GND 之间并靠近器件放置 0.1 µF 去耦电容,减少瞬态噪声与抖动对时序的影响。
  • 在高频钟控环境下注意走线阻抗匹配与上升/下降沿整形,以保证时序裕量。

五、版本更迭提示与样品测试建议

自 2023 年 SQ 批次以后该型号已升级为新版本,设计与采购前请务必提前拿到样品做完整验证。建议测试项目包括但不限于:功能一致性测试、时序/最大工作频率、输出电流与电压特性、功耗与温升、三态切换行为、ESD/抗扰性能与焊接回流可靠性。若用于量产,建议进行首批放大试产验证以确认版本差异对系统的影响。

六、封装与可靠性注意

SOP-16 封装适配常见 PCB 布局与手动/自动贴片工艺。注意焊接工艺参数、湿敏等级与储存条件;高输出电流工作模式下请评估功耗分配与散热方案,避免超过 Pd 限制导致器件过热或性能退化。

如需器件详细引脚定义、典型应用电路或完整参数表,请告知,我可提供更详细的技术资料与参考设计建议。

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