WMSIC Electronic Components

HGSEMI SP3485EIDQ3/TR SP3485EIDQ3

ModelSP3485EIDQ3/TR
PackageDFN-8(3x3)
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI SP3485EIDQ3 / TR
Type
HGSEMI
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
SP3485EIDQ3/TR
Electronic Component
1
Package
DFN-8(3x3)
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.176g
Electronic Component
256
Electronic Component
1
Features
Tx / Rx;;;; Low Power
Electronic Component
BM0265070245
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Receiver
1
Data
12Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP3485EIDQ3/TR 产品概述

一、简要说明

SP3485EIDQ3/TR 是华冠(HGSEMI)推出的一款工业级半双工 RS-485/RS-422 收发器,针对 3.3V 系统优化设计。器件采用 DFN-8 (3×3 mm) 封装,单驱动器/单接收器结构,支持最大 12 Mbps 数据速率,网络节点数可达 256 个,工作温度范围 -40℃ 至 +85℃,适合苛刻环境下的长线差分通信应用。

二、主要规格亮点

  • 工作电压:3.0 V ~ 3.6 V(典型 3.3 V)
  • 数据速率:最高 12 Mbps(半双工)
  • 驱动器 / 接收器:1 / 1
  • 支持节点数:多点网络下最多 256 节点
  • 静电防护:±15 kV(IEC 61000-4-2 等效)
  • 工作温度:-40℃ ~ +85℃
  • 封装:DFN-8 (3×3 mm)
  • 通讯模式:半双工,差分总线标准兼容 RS-485/RS-422

三、功能与保护特性

该器件集成多项实用保护与节能功能,提高可靠性与系统可用性:

  • Tx/Rx 启用控制:提供独立的发送/接收使能,便于总线仲裁与多节点管理。
  • 使能关断(Enable Shutdown):能够通过使能脚实现器件低功耗关断,降低待机能耗。
  • 热关断保护:器件内部具有过热检测与热关断机制,防止温度异常导致的损伤。
  • 过流保护:驱动输出具备短路/过流限制,有助于防止总线短路或错误接线引发的损坏。
  • 低功耗模式:在空闲或待机状态下自动或通过控制进入低功耗模式,适合电池或节能型系统。

四、设计与应用建议

SP3485EIDQ3/TR 适用于工业控制与楼宇自动化等对可靠性与抗干扰要求高的差分通信场景。典型应用包括:

  • 工业现场总线、PLC 与远程 I/O
  • 数据采集、传感器网络与过程控制
  • 楼宇设备、门禁与电梯通信系统
  • 电表与能源管理系统
    在布局与布线时建议注意差分对布线对称性、终端电阻匹配及必要的共模抑制措施;利用其使能与低功耗特性可构建节能的多节点网络。

五、小结

SP3485EIDQ3/TR 提供高达 12 Mbps 的半双工差分通信能力、宽电压与工业级温度范围,以及多重保护与低功耗特性,是面向高密度、多节点 RS-485/RS-422 网络的可靠选择。DFN-8 紧凑封装利于空间受限的 PCB 布局,适合对抗干扰、长距离通信与工业级应用场景。若需进一步的电气参数、引脚定义或参考电路图,可参考 HGSEMI 的详细数据手册以完成系统设计与验证。

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