WMSIC Electronic Components

(5 Pcs) XC6202P332PR

ModelXC6202P332PR
PackageSOT-89
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
7 options
Configuration XC6206P332PR · CNY · XC6206P332PR · BM0258662028 · 5 · 3797092 · 0.224

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
HXY MOSFET XC6206P332PR
Type
SOT-89
Unit
Pcs
Minimum package
5 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
XC6206P332PR
Electronic Component
1
Package
SOT-89
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.154g
Electronic Component
1
Electronic Component
BM0258662028
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
7V
Output
Electronic Component
Output Voltage
3.3V
Output Current
500mA
Output Type
Electronic Component
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC6206P332PR 产品概述

一、产品简介

XC6206P332PR 是一款固定输出型低压差线性稳压器(LDO),输出电压为 3.3V,最大输出电流可达 500mA。器件采用 SOT-89 封装,适合对体积和成本敏感且需中等电流供应的便携与嵌入式应用。该款器件在待机状态下静态电流仅 8µA,配合 40dB 的电源纹波抑制比(PSRR),在低功耗与中等抑制性能之间取得良好平衡。

二、主要规格一览

  • 输出类型:固定(3.3V)
  • 最大输入电压/工作电压:7V(请按实际电路和数据手册验证)
  • 最大输出电流:500mA
  • 静态电流(Iq):约 8µA
  • 电源纹波抑制比(PSRR):约 40dB
  • 保护特性:过流保护、短路保护
  • 工作温度范围:-40℃ ~ +85℃(Ta)
  • 输出极性:正极输出
  • 通道数:单通道
  • 封装:SOT-89
  • 品牌:HXY MOSFET(华轩阳电子)

三、关键特性解读

  1. 低静态电流:8µA 的待机电流使本器件非常适合电池供电或需长待机时间的系统,能够在不牺牲基本稳压性能的前提下降低静态能耗。
  2. 中等电流输出:最多 500mA 的输出能力可满足 MCU、传感器、低功耗无线模块等模块供电需求,但在靠近极限工作时需关注热量管理。
  3. PSRR ≈ 40dB:对于中低频的电源纹波抑制具有明显效果,有助于降低电源噪声对模拟电路或射频前端的影响。
  4. 保护功能:内置过流与短路保护,提升系统的安全性与可靠性,便于在异常工况下保证器件与负载的安全。

四、封装与热管理建议

SOT-89 封装体积小、适用于中等功耗场合,但其散热能力有限。在输入电压与输出电流同时偏高时(例如 Vin 接近 7V 且输出 500mA),器件功耗(Vin-Vout)× Iout 可能较大,需注意结温上升。建议:

  • 通过增加 PCB 铜箔面积(散热铜皮)来改善散热;
  • 在高功耗应用中降低输入电压或限制最大输出电流;
  • 布局时为 GND 和引脚附近预留散热加强区。

五、外部元件与 PCB 布局要点

  • 输入侧建议在靠近 VIN 引脚放置一个低 ESR 去耦电容(典型 0.1µF ~ 1µF),以抑制输入瞬态与高频纹波。
  • 输出侧应根据稳压器的稳定性要求和负载特性选择合适的输出电容(常用 1µF ~ 10µF,低 ESR 的陶瓷或固态电容),确保环路稳定。具体电容类型与数值请参照器件的详细数据手册。
  • 布线尽量短且粗,输入、输出与地回路应最小化环路面积,地线采用完整的地平面或粗电流回流路径以减小寄生阻抗。
  • 对有噪声敏感的外设,应在输入与输出端采用适当的 EMI 抑制措施(如 RC 滤波或磁珠)。

六、典型应用场景

  • 手持与便携终端的 3.3V 供电(传感器、MCU、显示驱动等);
  • 低功耗物联网节点与无线模块(需注意峰值电流时的瞬态响应);
  • 工业控制板中单路 3.3V 电源;
  • 模拟前端或参考电源(在满足 PSRR 与噪声要求的前提下)。

七、使用注意与可靠性建议

  • 在设计阶段务必进行热仿真或测量,确认在最恶劣工况下结温不过高;
  • 若系统有较大输入纹波或需在高频干扰环境工作,应验证 PSRR 在对应频段的表现;
  • 确认所选外部电容器满足长期温度与电压可靠性要求;
  • 在批量设计前建议获取器件完整数据手册并做样机验证,以确保在目标工况下的稳定性与可靠性。

如需更详细的电气特性曲线、典型应用电路或封装引脚图,请提供是否需要我帮助查找或整理厂商完整数据手册。

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