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HCI 0121M4-25000FTLDTNJL 0121M4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 0121M4-25000FTLDTNJL
- Type
- SMD2016-4P
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 0121M4-25000FTLDTNJL
- Electronic Component
- 1
- Package
- SMD2016-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.02g
- Frequency
- 25MHz
- Electronic Component
- 1
- Electronic Component
- BM0264982124
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12.5pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0121M4-25000FTLDTNJL 产品概述
一 概要
0121M4-25000FTLDTNJL 为 HCI（杭晶）全国产化贴片晶振，封装规格 SMD2016-4P（2.0 × 1.6 mm，四端），基准频率 25.000 MHz。器件针对高密度 SMT 应用优化，体积超小、厚度极薄，适合对频率精度与体积有较高要求的电子设备。
二 主要技术参数
- 频率：25.000 MHz
- 常温频差：±10 ppm（室温标称）
- 频率稳定度（含温度影响等）：±20 ppm
- 负载电容：12.5 pF
- 等效串联电阻（ESR）：100 Ω（典型）
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装：SMD2016-4P（4Pad）
三 电路与使用建议
- 负载电容匹配：晶振标称 CL = 12.5 pF。对称电容值可按公式估算：C1 = C2 ≈ 2 × (CL − Cstray)，其中 Cstray（PCB 与封装寄生）通常取 2–5 pF。
- 与 MCU/振荡器内部电路配合时，应参考主控器件的数据手册，确保驱动电平与负载匹配，避免过驱或欠驱导致频率漂移或启动问题。
- 布线建议：信号贴近晶振引脚，缩短引脚到器件的走线长度，敏感信号与地隔离，尽量采用地平面以降低噪声。
四 封装与安装
SMD2016-4P 四端设计，其中两端为晶体电极，另两端用于接地/屏蔽，便于降低接地电阻和提高抗干扰能力。支持标准 SMT 回流焊工艺，建议按 JEDEC/IPC 推荐的回流曲线执行。存储与贴装时注意防潮、防机械应力，避免在回流过程中发生翻转或受力变形。
五 适用场景
适用于通信设备、网络接口模块、工业控制、消费电子、物联网节点、测试与测量仪器等需要 25 MHz 精准时钟源的场合。因工作温度上限为 +85 ℃，不建议用于高温汽车电子环境。
六 可靠性与采购建议
杭晶（HCI）国产化生产，便于量产供货与替代。批量采购建议确认包装形式（卷带）与保质期，生产接收时做好焊接兼容性与频率抽检。关键应用建议与供应商确认老化、可靠性测试数据以及必要的定制化要求。
如需器件样片、封装尺寸图或 PCB land pattern 建议，请提供联系方式或项目应用细节，以便提供更精确的支持与资料。
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