WMSIC Electronic Components

HF HFD4/24-SR HFD4

ModelHFD4/24-SR
PackageSMD,10x6.5mm
BrandHF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HF HFD4 / 24-SR
Type
HF
Minimum package
900 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HF
Electronic Component
HFD4/24-SR
Electronic Component
1
Electronic Component
6.5mm
Package
SMD,10x6.5mm
Electronic Component
Signal Relay
Electronic Component
3.416g
Electronic Component
10mm
Electronic Component
8
Electronic Component
1
Electronic Component
3ms
Electronic Component
BM0231051813
Operating Temperature
40℃~+85℃
Contact Resistor
100mΩ
Coil Voltage
24V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HFD4/24-SR 信号继电器产品概述

一、产品概述

HFD4/24-SR 是 HF(宏发)推出的一款紧凑型表面贴装信号继电器,封装尺寸为 10 × 6.5 mm,8 引脚、双刀双掷(2C / DPDT)触点结构,面向小信号切换和控制应用。继电器线圈工作电压为 24V,属低功耗、有极性单线圈类型,兼顾体积小、动作快速与低接触电阻的特点,适用于通讯、测试仪器、工控和消费类电子中的信号切换场合。

二、主要性能参数

  • 线圈电压:24 VDC
  • 额定线圈功率:200 mW(线圈电阻 2.88 kΩ,静态线圈电流约 8.33 mA)
  • 触点形式:两组转换(2C / DPDT),引脚数:8
  • 触点材料:AgNi + 镀金(增强低电平开关可靠性)
  • 触点容量(电阻负载):1 A @ 30 VDC;300 mA @ 125 VAC
  • 最大切换电压:250 V AC;220 V DC
  • 最大切换电流:2 A(瞬态或特殊场景下)
  • 接触电阻:≤100 mΩ
  • 动作时间 / 释放时间:约 3 ms / 3 ms
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装方式:SMD(表面贴装),尺寸 10 × 6.5 mm

三、特点与优势

  • 体积小、布局密集时占板面积小,适合高密度电路设计。
  • 低线圈功耗(200 mW),适合便携或功耗敏感系统。
  • 镀金触点对微弱信号具有更好接触可靠性和低噪声开关特性,适合音频或低电平信号切换。
  • 快速响应(动作/释放约 3 ms),适合高频率切换需求的信号路径控制。
  • 宽温度范围和较低接触电阻,利于长期可靠性。

四、典型应用场景

  • 通信设备与交换机中的信号路由与隔离。
  • 仪器仪表、自动测试设备(ATE)中的通道切换。
  • 音频设备的输入/输出切换与静音控制。
  • 低功耗控制系统、智能终端的外围开关。
  • 小功率电源或继电保护中的控制回路(在额定范围内使用)。

五、使用建议与注意事项

  • 线圈为有极性单线圈,布线时注意接线极性,避免反接造成线圈损坏或动作异常。
  • 若在驱动端并联抑制元件(例如反并联二极管、RC 吸收等),会影响释放时间与电磁兼容特性,应根据系统对响应速度与干扰抑制的权衡选择合适方案并验证。
  • 切换负载时应遵守额定触点容量,尽量避免在额定电流/电压附近长期切换高感性或高容性负载,必要时并联限流或使用外部缓冲器。
  • 对于微弱直流信号或音频信号,依赖镀金触点可提高可靠性;但在存在污染或腐蚀性气氛的环境中仍需注意密封与环境防护。

六、封装、焊接与 PCB 布局建议

  • 采用标准 SMD 回流焊工艺,设计 PCB 焊盘时参考厂方推荐封装图和焊盘尺寸以保证焊接可靠性与热稳定性。
  • 若板上需要进行手工波峰或再流焊接,务必遵循元件的最高允许回流温度和时长(详见厂家数据手册)。
  • 为减小电磁干扰与驱动回路噪声,建议线圈电源走线短且靠近地面层布线,驱动器采用合适的驱动能力与保护元件。

七、常见故障与排查要点

  • 继电器不吸合:检查线圈供电电压、极性与驱动电路;测量线圈电阻确认无断路。
  • 吸合但接触不良:检查触点是否被污染或受机械冲击导致接触不稳定;测量接触电阻是否超出规格。
  • 动作/释放变慢:排查是否并联了大电容或吸收元件,或线圈供电不足;环境温度极端也会影响响应速度。

总结:HFD4/24-SR 以其小尺寸、低功耗、快响应和镀金触点特性,在信号级别的切换与控制应用中具有良好适配性。具体设计与焊接参数请结合宏发提供的产品规格书与封装图纸进行最终验证与定稿。

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