Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRS BM28B0.6-10DP/2-0.35V(51) BM28B0.6
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HRS BM28B0.6-10DP / 2-0.35V(51)
- Type
- HRS
- Minimum package
- 20000
Technical parameters
- Electronic Component
- HRS
- Electronic Component
- BM28B0.6-10DP/2-0.35V(51)
- Electronic Component
- 1
- Package
- SMD,P=0.35mm
- Electronic Component
- 2
- Electronic Component
- and Connector
- Electronic Component
- 0.016g
- Electronic Component
- 0.35mm
- PIN
- 10P
- Electronic Component
- 1
- Electronic Component
- BM0257328734
- Electronic Component
- Electronic Component
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Voltage
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BM28B0.6-10DP/2-0.35V(51) 产品概述
一、产品简介
BM28B0.6-10DP/2-0.35V(51) 是广濑（HRS）系列高密度板对板/背板连接器的一款立贴式互连器件，采用 0.35mm 芯距设计，双排接针结构，适用于对空间和信号完整性有较高要求的电子设备内部连接场合。产品以紧凑体积实现高接点密度，利于轻薄化与模块化设计。
二、主要参数
- 间距：0.35 mm（P=0.35mm）
- 排数：2 排
- 安装方式：立贴（SMD）
- 触头镀层：金（接触面金属镀层，提升接触可靠性）
- 工作温度范围：-40℃ ~ +85℃
- 适用封装：SMD 表面贴装
三、结构与材料
该连接器采用双列接触设计，保持信号通道紧密排列以缩短走线长度并减小串扰。接触端子镀金处理，提高耐腐蚀性与低电阻接触性能。外壳和骨架材料选型兼顾机械强度与耐温性，适合常见商用与工业环境温度范围内长期可靠工作。
四、功能与特点
- 高密度：0.35mm 间距支持更高的接点数量，适合多通道高速信号或多电源线布局。
- 可回流焊贴装（SMD）：便于自动化生产与高产能组装。
- 立贴结构：节省板面空间、利于模块化垂直对接设计。
- 金属镀层触头：保证低接触电阻、改善接触稳定性与寿命。
- 宽温工作范围：满足-40℃至+85℃多数工业与消费类应用需求。
五、典型应用场景
适用于移动终端模组连接、通信设备子板与主板互连、摄像模组与主板对接、嵌入式单板与扩展卡背板连接、工业控制、物联网设备及需实现高密度互连场合的电子设备内部结构。
六、选型与使用建议
在选型时应结合所需通道数、信号类别（高速差分/单端）、机械对位公差及板间间距要求；布局时注意差分对布线、接地屏蔽和电源回流路径，以维持信号完整性与电磁兼容性能。推荐与供应商确认插拔次数、耐压和插入力等详细机械电气规范以满足具体设计需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
