Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRS DF37C-24DP-0.4V(51) DF37C
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HRS DF37C-24DP-0.4V(51)
- Type
- HRS
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRS
- Electronic Component
- DF37C-24DP-0.4V(51)
- Electronic Component
- 1
- Package
- SMD,P=0.4mm
- Electronic Component
- 2
- Electronic Component
- and Connector
- Electronic Component
- 0.095g
- Electronic Component
- 0.4mm
- PIN
- 24P
- Electronic Component
- 1
- Electronic Component
- BM0265730020
- Electronic Component
- Electronic Component
- Operating Temperature
- 35℃~+85℃
- Electronic Component
- Electronic Component
- Voltage
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DF37C-24DP-0.4V(51) 产品概述
一、基本信息
DF37C-24DP-0.4V(51) 是一款由日本广濑(HRS)公司生产的板对板与背板连接器，采用立贴封装(SMD)。该产品设计用于高可靠性的电子设备，适用于需要紧凑空间和高密度连接的应用场景，具有300mA的额定电流和0.4mm的引脚间距，适合于各类电子产品。
二、产品特点
小型化设计： DF37C-24DP-0.4V(51) 的引脚间距为0.4mm，极大地缩小了连接器的占用空间，使其能够满足当前电子装备对小型化和轻量化的需求。
高电流承载能力： 该连接器额定电流达300mA，能够支持一些需要较高功率的应用，同时确保数据可靠传输。
优良的接触性能： 采用高质量的材料和先进的生产工艺，DF37C-24DP-0.4V(51) 提供了优秀的电气接触性能，能够有效减少接触电阻和信号衰减，确保在高速信号传输中的可靠性。
自动贴装能力： SMD类型的封装设计意味着DF37C-24DP-0.4V(51) 适合于自动贴装设备，减少人工焊接的复杂性和可能故障，提升生产效率。
耐用性： 该连接器具有良好的耐环境能力，能够在各种工作环境下稳定工作，包括高温和潮湿等极端条件，保证了产品的长期可靠性。
三、规范与参数
- 连接器类型：板对板连接器
- 配置：24个引脚
- 引脚间距：0.4mm
- 额定电流：300mA
- 封装形式：表面贴装(SMD)
- 品牌：广濑(HRS)
四、应用场景
DF37C-24DP-0.4V(51) 连接器广泛应用于许多电子产品中，尤其是在需要高密度连接的场合。主要应用场景包括：
消费电子产品：如手机、平板电脑、笔记本电脑等，它们需要在有限的空间内提供高性能的连接解决方案。
工业设备：在工业自动化和控制系统中，这种连接器能够确保设备的稳定性和可靠性。
医疗设备：在医疗器械中，DF37C-24DP-0.4V(51) 能够提供稳定的电源和信号传输，确保设备正常运作。
汽车电子：随着汽车电子技术的发展，越来越多的智能组件和系统使用此类小型连接器，以减少车内空间的占用，同时确保性能。
五、总结
DF37C-24DP-0.4V(51) 作为一款优秀的板对板与背板连接器，具备小型化、高电流承载、优良的接触性能以及适合自动贴装的优势，随着全球电子设备向高集成度和小型化的趋势发展，必将在多个领域获得广泛应用。其优异的性能与可靠性能够满足各种应用的需求，为电子元器件行业的发展提供了重要的支持。选择DF37C-24DP-0.4V(51) 将是实现创新设计与高性能连接的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
