WMSIC Electronic Components

JJW JST131V-800D JST131V

ModelJST131V-800D
PackageSOT-223
BrandJJW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JJW JST131V-800D
Type
JJW
Minimum package
4000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JJW
Electronic Component
JST131V-800D
Electronic Component
1
Package
SOT-223
Electronic Component
Thyristor (SCR) / Module
Electronic Component
0.205g
Electronic Component
1
Electronic Component
BM0257711048
Operating Temperature
40℃~+125℃
Surge Current
18A
Latching Current(Ih)
7mA
Current(It)
1A
Electronic Component
Electronic Component
Electronic Component
4000
Voltage(Vtm)
1.45V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

JST131V-800D 产品概述

JST131V-800D 是捷捷微(JJW)推出的一款双向可控硅(双向晶闸管),采用 SOT-223 封装,针对小功率交流开关与半导体继电器等应用场景优化。器件具备较低的门极触发电压和较小的保持电流,适合低驱动电流控制电路,并兼顾一定的浪涌承受能力与宽温区可靠性。

一、主要参数一览

  • 型号:JST131V-800D
  • 品牌:JJW(捷捷微)
  • 封装:SOT-223(散热片焊盘便于 PCB 散热设计)
  • 门极触发电压 Vgt:1.3 V
  • 门极触发电流 Igt:10 mA
  • 保持电流 Ih:7 mA
  • 断态峰值电压 Vdrm(Vrsm):800 V
  • 通态峰值电压 Vtm(Vtm):1.45 V
  • 通态电流 It(持续):1 A
  • 浪涌电流(非重复峰值):18 A
  • 门极平均耗散功率 PG(AV):500 mW
  • 工作温度范围:-40 ℃ ~ +125 ℃

二、主要特性与优势

  • 低门极触发电压(1.3 V)与较低驱动电流要求(Igt 10 mA),便于与单片机、光耦或低电平驱动电路直接配合使用。
  • 高达 800 V 的断态峰值电压,适合 220 VAC 或更高直流阻断要求的场合。
  • SOT-223 小型封装兼具良好的热性能,便于在 PCB 上实现经济的散热方案。
  • 浪涌承受能力达 18 A(非重复),能在启动或短时过载情形下保持一定可靠性。
  • 宽温度工作范围,适合工业级环境使用。

三、典型应用场景

  • 小功率交流负载开关:家电照明调光、电热器、小型风扇等。
  • 半导体继电器与静态开关模块。
  • 相位控制电路(调光器、速度控制器)与交流功率调节。
  • 浪涌保护与简易过流保护电路的可控断开元件。
  • 与光耦、微控制器驱动的固态开关单元。

四、设计与使用建议

  • 门极驱动:建议设计驱动电流略高于 Igt(例如 15–20 mA)以保证可靠触发,同时注意门极平均耗散功率 PG(AV)=500 mW,不要长时间将门极在高电流下工作。
  • 热管理:SOT-223 封装虽有良好热传导特性,但器件连续导通电流为 1 A,建议在 PCB 布局中提供充足铜箔散热区并考虑必要的散热片或过孔散热措施,以降低结温并延长寿命。
  • 浪涌与保护:尽管器件可承受 18 A 的浪涌电流,但不建议频繁处于浪涌状态。对于有高能量浪涌或感性负载的场合,应并联适当的 RC 吸收或 TVS 器件以抑制电压突变。
  • 开关特性:通态压降 Vtm≈1.45 V,在设计功耗预算时需考虑此电压与负载电流的乘积作为导通损耗的一部分。
  • 环境与老化:在高温或高湿环境下,注意器件的长期电气特性漂移,必要时采用合适封装保护与可靠性验证。

五、封装与订购信息

  • 封装:SOT-223,便于表面贴装与手工焊接;板上留出适当焊盘与散热铜箔可提升热性能。
  • 生产与检验:由 JJW(捷捷微)制造,适用于中小批量和大批量的电子产品生产需求。

总结:JST131V-800D 以其低门极触发门槛、较高的耐压能力和小型 SOT-223 封装,适合用于各类小功率交流开关与相位控制场合。在设计中应重视门极驱动、电路保护与热管理,确保器件在额定条件下稳定可靠运行。若需更详细的电气特性曲线或封装尺寸图,请参考 JJW 的产品数据手册或联系供应商获取样品验证。

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