WMSIC Electronic Components

LGE BC337-25 BC337

ModelBC337-25
PackageTO-92
BrandLGE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LGE BC337-25
Type
LGE
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LGE
Electronic Component
BC337-25
Electronic Component
1
Package
TO-92
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.197g
Electronic Component
1
Electronic Component
BM0230873936
Transistor Type
NPN
Frequency(f T)
210MHz
Power Dissipation(Pd)
625mW
Electronic Component
Electronic Component
Electronic Component
1000
Collector Current(Ic)
800mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC337-25 产品概述

一、概述

BC337-25 是一款常用的通用 NPN 双极型晶体管,鲁光(LGE)品牌,TO-92 塑封直插封装。器件面向中低功率放大与开关场合,具备较高的电流承载能力与中等电流增益,适合各种电子设备中的驱动与信号放大用途。

二、主要技术参数

  • 晶体管类型:NPN
  • 集电极电流 Ic:800 mA(最大)
  • 集射极击穿电压 Vceo:45 V
  • 最大耗散功率 Pd:625 mW
  • 直流电流增益 hFE:160(于 Ic=100 mA、VCE=1 V 条件)
  • 特征频率 fT:210 MHz
  • 集电极截止电流 Icbo:100 nA
  • 集电极饱和电压 VCE(sat):700 mV(典型)
  • 射基极击穿电压 Vebo:5 V
  • 封装:TO-92
  • 品牌:LGE(鲁光)

三、特性与优势

  • 中等至较高的集电极电流能力(最大 800 mA),可直接驱动小型继电器、指示灯组或小功率电机。
  • Pd=625 mW 在 TO-92 封装条件下,能满足多数低功率开关与放大场景,但需注意散热与环境温度对额定功率的影响。
  • hFE≈160(在 100 mA 时)表明器件在中等偏流下具有良好放大能力,适用于音频前级、小信号放大及电流放大环节。
  • fT=210 MHz 支持一定带宽的信号处理,适合中频放大与高速开关应用。
  • 低 Icbo(100 nA)意味着在常温下漏电流较小,有利于提高待机性能与降低静态误差。

四、典型应用

  • 低功耗继电器、LED 驱动、直流电机小电流驱动
  • 音频前级放大、信号放大器、缓冲级
  • 数字电路开关、逻辑电平转换与功率放大器前置驱动
  • 一般电子设备的通用替换元件

五、使用建议与注意事项

  • 热管理:TO-92 封装的热阻较大,工作时应控制结温,不宜长时间在额定 Pd 下运行;在高环境温度或连续大电流工况下应适当降额使用或增加散热措施。
  • 开关驱动:为确保饱和导通,开关时基极驱动电流应选为 Ic/(10~20),可确保 VCE(sat) 接近标称值。
  • 偏置与线性放大:线性区工作时注意 hFE 随温度和电流变化较大,电路设计应考虑增益漂移与偏置稳定性。
  • 极性与击穿:Vceo=45 V、Vebo=5 V,确保电路中相应电压不超过极限值,避免反向破坏。高温下 Icbo 可能增大,应在电路设计中留有裕量。
  • 封装引脚与图纸:TO-92 常见三脚排列可能因厂家不同而异,装配前请参照鲁光官方数据手册核对引脚定义与封装图。

六、封装与采购建议

BC337-25(LGE 鲁光)以 TO-92 塑封供应,适合直插装配与手工焊接。批量采购或用于量产时建议索取样品并查看完整数据手册、最大额定曲线及典型特性曲线,确认电气与热特性满足具体应用,同时关注器件的存储与防静电要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.