WMSIC Electronic Components

LX HEF4528BT(LX) HEF4528BT

ModelHEF4528BT(LX)
PackageSOP-16
BrandLX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LX HEF4528BT(LX)
Type
LX
Minimum package
4000 卷

Technical parameters

Electronic Component
LX
Electronic Component
HEF4528BT(LX)
Electronic Component
1
Package
SOP-16
Electronic Component
Monostable Multivibrator
Electronic Component
4000
Electronic Component
0.262g
Electronic Component
1
Channel Count
2
Features
positions
Electronic Component
BM0264498277
Operating Temperature
40℃~+125℃
Operating Voltage
3V~12V
Logic Type
Electronic Component
Current(IOH)
1.1mA
Current(IOL)
1.1mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HEF4528BT(LX) 产品概述

HEF4528BT(LX) 是灵星芯微(LX)提供的一款双通道单稳态多谐振荡器(Dual Monostable Multivibrator),封装为 SOP-16,属于经典的 4000 系列 CMOS 器件。器件工作电压范围宽(3V ~ 12V)、功耗低、抗干扰能力强,适合多种计时与脉冲整形应用。

一、主要参数与特性

  • 逻辑类型:单稳态(One-shot)
  • 通道数:2(双通道)
  • 工作电压:3V ~ 12V(宽电源范围,兼容多种系统电压)
  • 传播延迟 (tpd):约 60 ns(中等速度响应,适合大部分定时场合)
  • 输出驱动能力:IOL = 1.1 mA,IOH = 1.1 mA(典型 CMOS 输出驱动,应避免直接驱动大电流负载)
  • 工作温度:-40 ℃ ~ +125 ℃(工业级温度范围)
  • 封装:SOP-16
  • 系列:4000 系列 CMOS
  • 功能特性:脉冲宽度可调、可重触发功能、复位输入

二、功能概述与工作原理

HEF4528BT 提供两个独立的单稳态通道。每个通道通过外接电阻 R 和电容 C 来设置输出脉冲宽度(脉冲宽度随 R、C 值成比例变化,可从纳秒到秒级调整)。器件具备可重触发能力:在一次输出脉冲未结束时若再次触发,可延长或重新产生脉冲(具体行为取决于触发与复位时序)。另外设有复位输入,用于即时清除输出或保证初始状态,便于系统控制。

三、典型应用场景

  • 开关抖动消除(按键去抖)
  • 脉冲延时与定时(脉冲拉伸、延迟触发)
  • 信号整形与单脉冲产生(将短脉冲放大成标准宽度)
  • 周期性事件的脉冲化与门控逻辑
  • 与微控制器接口的时间控制与同步电路

四、设计与使用建议

  • 去耦与电源完整性:在 VCC 与 GND 之间靠近芯片放置 0.01 μF~0.1 μF 陶瓷去耦电容,降低噪声与瞬态影响。
  • 外接元件选择:脉冲宽度由外接 R、C 决定,在选择时注意容差与温漂对精度的影响。对于长时间常数,优先使用低漏电的电解或钽电容并配合并联小容值以改善响应。
  • 输入输出保护:输入引脚禁止悬空,应有明确上拉或下拉;输出驱动能力有限(约 1.1 mA),若需驱动继电器、LED 或大电流负载,建议加缓冲驱动器或功率级。
  • 温度与容差:4000 系列 CMOS 在温度极限时参数会变化,关键计时场合需考虑温度补偿或标定。
  • PCB 布局:高速触发与地回路应短而粗,避免长走线引入寄生电容产生误触发。

五、与同类器件比较

相较于传统 NE555 等单一单稳器件,HEF4528BT 的优势在于双通道集成、宽电源范围、CMOS 低功耗与更高的噪声免疫。其传播延迟 ~60ns 属于中速,适合多数定时与脉冲整形任务,但不适用于要求高输出驱动或高精度亚微秒级定时的场合。

六、封装与采购信息

  • 品牌:LX(灵星芯微)
  • 封装形式:SOP-16,适合自动贴片与标准 PCB 设计
  • 常用购买描述:HEF4528BT(LX) SOP-16,双通道单稳态多谐振荡器,工作电压 3V~12V,温度 -40 ℃~+125 ℃

总结:HEF4528BT(LX) 以其双通道集成、可调脉冲宽度、可重触发与复位输入等特点,适合在低功耗、宽电源范围的计时与脉冲处理场合中替代传统一体化单稳态解决方案。设计时注意外接 R/C 精度、去耦与输出驱动能力,即可获得稳定可靠的定时性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.