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(5 Pcs) ME6211C28U4AG-N
Configuration
5 options
Configuration
ME6211C28U4AG-N · CNY · ME6211C28U4AG-N · BM0264354711 · 5 · 3807621 · 0.159
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- MICRONE ME6211C28U4AG-N
- Type
- X2-SON-4-EP(1X1)
- Unit
- Pcs
- Minimum package
- 5 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 220mV@(200mA)
- Electronic Component
- MICRONE
- Electronic Component
- 50uVrms
- Electronic Component
- ME6211C28U4AG-N
- Electronic Component
- 1
- Package
- X2-SON-4-EP(1x1)
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.441g
- Electronic Component
- 1
- Electronic Component
- BM0264354711
- Operating Temperature
- 40℃~+150℃
- Operating Voltage
- 6V
- Output
- Electronic Component
- Output Voltage
- 2.8V
- Output Current
- 450mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ME6211C28U4AG-N 产品概述
一、概述
ME6211C28U4AG-N 是南京微盟（MICRONE）推出的一款高精度、低噪声 CMOS LDO 稳压器，固定输出 2.8V，工作电压最高可达 6V，输出电流最高 450mA。器件集成参考源、误差放大器、驱动晶体管、限流与相位补偿，具有快速启动、低压差、优异瞬态响应和高 PSRR，专为前端手机及高性能便携设备电源设计。
二、主要规格
- 输出极性：正极（固定输出）
- 输入电压（最大）：6V
- 输出电压：2.8V（固定）
- 最大输出电流：450mA
- 压差（典型）：220mV @ 200mA
- 静态电流 Iq：30µA
- 输出噪声：50µVrms
- PSRR：62dB @ 10kHz
- 工作温度：-40℃ ～ +150℃
- 通道数：1
- 封装：X2-SON-4-EP (1×1)
三、关键特性
- 低噪声与高 PSRR：50µVrms 的低输出噪声与在 10kHz 时 62dB 的纹波抑制，适合模拟、RF 前端与敏感 ADC 供电。
- 低压差与高效率：在中等负载下压差仅数百毫伏，能改善电池供电效率。
- 低静态电流：30µA 待机电流有利于延长电池寿命。
- 全面的保护机制：内部短路保护/折返限流、过流保护与热关断，保障系统安全。
- CE 管脚：可通过使能引脚快速上电或进入低功耗关断状态。
- 兼容陶瓷电容：对低 ESR 的陶瓷输出电容（X5R/X7R）稳定性友好，便于降低 BOM 成本。
四、典型应用与设计建议
- 典型应用：智能手机前端、射频模块、相机模组、传感器供电、低噪声模拟电源等。
- 输出电容建议：1µF ～ 10µF 低 ESR X5R/X7R 陶瓷，推荐 ESR 足够低（<100mΩ）以保证环路稳定。输入端建议配 1µF 陶瓷去耦并靠近器件 VIN 引脚布置。
- 热管理：在最差工况（Vin=6V, Vout=2.8V, Iout=450mA）器件耗散约 1.47W，应保证底部散热焊盘与大面积铜箔，必要时增加 PCB 散热区域以避免热关断。
- PCB 布局：VIN、VOUT 与 GND 的去耦电容尽量靠近封装，散热焊盘焊满并与多层地平面连通，CE 引脚通过 MCU 或上拉电阻控制以实现低功耗管理。
五、封装与可靠性
ME6211C28U4AG-N 提供 X2-SON-4-EP (1×1) 微型封装，带底部热电连接焊盘，适合空间受限应用，符合工业温度等级（-40℃ 至 +150℃），并具备完整的短路、过流与热保护，提升系统可靠性与长期稳定性。
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