WMSIC Electronic Components

Nexperia BC850C,215 BC850C

ModelBC850C,215
PackageSOT-23
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BC850C, 215
Type
NEXPERIA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BC850C,215
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0000280532
Operating Temperature
65℃~+150℃
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
250mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC850C,215 产品概述

BC850C,215 是一种高性能的 NPN 型晶体管,广泛用于各种电子电路中,如信号放大、开关控制和电源管理等应用。其出色的电气特性和紧凑的封装设计,使其成为现代电子设备不可或缺的基础组件之一。

主要参数

  • 晶体管类型:NPN
  • 最大集电极电流 (Ic):100 mA
  • 集射极击穿电压 (Vce):45 V
  • 额定功率:250 mW
  • 最大集电极截止电流 (ICBO):15 nA
  • 饱和压降 (Vce(sat)):600 mV @ 5 mA, 100 mA
  • 直流电流增益 (hFE):420 @ 2 mA, 5V(最小值)
  • 工作频率:100 MHz
  • 工作温度范围:最高可达 150°C(TJ)
  • 安装类型:表面贴装型 (SMD)
  • 封装类型:TO-236AB (也称 SC-59, SOT-23-3)

性能特征

BC850C,215 在电气特性上具有出色的表现。其集电极电流最大可达 100 mA,能够满足大多数中小功率应用的需求。其集射极击穿电压高达 45 V,提供了良好的过压保护能力,适合在较高电压的电路中使用。同时,具有 250 mW 的额定功率,多种工作条件下均可保持稳定性能。

其直流电流增益 (hFE) 达到 420,标明了该器件在作为放大器时的优良性能,这对于音频信号放大、传感器信号处理等应用尤为重要。该晶体管的 Vce 饱和压降在相对较低的电流下,仅为 600 mV,这意味着在开关操作时损耗较小,能够提高整体电路的效率。

应用场景

BC850C,215 可广泛应用于各类电子设备中,例如:

  1. 音频放大器:凭借其高增益和低噪声特性,能有效放大音频信号。
  2. 开关电路:可用于控制大功率负载的开关,适用于继电器驱动、电机控制等领域。
  3. 信号处理:该晶体管可用于低频到高频信号的处理,确保信号完整性。
  4. 传感器应用:在温度、压力、光照等传感器的信号放大中,提供可靠的性能。
  5. 电源管理:作为调节电源供给的组件,BC850C,215 能够保证电压与电流的稳定性。

封装与安装

BC850C,215 的封装采用 SOT-23-3 的小型表面贴装设计。这种设计不仅使其适合现代电子产品的小型化需求,同时也支持自动化生产线的贴装工艺,提高装配效率。TO-236AB 封装的引脚间距与布局非常适用于各种PCB设计,确保了更好的电路布线灵活性。

总结

BC850C,215 是一款性能卓越的 NPN 晶体管,结合了高电压、大电流、低功耗和高增益的优点。其可靠的电气性能和紧凑的封装设计,使其适用于多种电子应用,满足现代电子设备对高性能组件的需求。无论是在消费电子、通信设备还是工业控制系统,BC850C,215 都能提供必需的性能支持,是设计工程师和开发人员理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.