WMSIC Electronic Components

Nexperia BC846S,115 BC846S

ModelBC846S,115
PackageTSSOP-6(SOT-363)
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BC846S, 115
Type
NEXPERIA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BC846S,115
Electronic Component
1
Package
TSSOP-6(SOT-363)
Electronic Component
2 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0000037069
Operating Temperature
65℃~+150℃
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:BC846S,115

BC846S,115是一款由安世半导体(Nexperia)生产的NPN型双极性晶体管(BJT),它在电子电路中扮演着重要角色,尤其是在信号放大和开关应用中。该器件的设计和构造使其在高效能和可靠性方面具有出色表现,因此在消费电子、通信、工业控制等多个领域得到广泛应用。

产品规格详细解析

  1. 晶体管类型
    BC846S,115为NPN型双极性晶体管,每个包装内包含两个晶体管,适合用于驱动负载或增加电路设计的灵活性。NPN类型的特性使得其适用于常见的开关和放大电路,能够稳定地处理高频信号。

  2. 电流和电压特性

    • 最大集电极电流(Ic):100mA. 该晶体管能够支持相对较大的负载电流,适合多种电流应用。
    • 最大集射极击穿电压(Vceo):65V. 这一高电压允许BC846S,115在多种电压环境下安全工作,减少了电路设计时对电压的限制。
    • 集电极截止电流(ICBO):最大15nA. 这一低截止电流表明,该器件在关断状态下具有极低的泄漏电流,使其更适合于低功耗应用。
  3. 饱和压降和DC电流增益

    • Vce饱和压降(最大值):300mV @ 5mA和100mA. 低饱和压降有助于提高电路的整体效率,未经处理的信号损耗得以最小化。
    • DC电流增益(hFE):在2mA时最小值为110 @ 5V。高增益特性使得BC846S,115能够有效放大输入信号,适合于信号放大电路。
  4. 功率和频率特性

    • 最大功率:300mW. 这一功率处理能力使得BC846S,115适合用于中等功率应用,提供了更大的设计选择。
    • 频率跃迁:可达100MHz. BC846S,115在高频操作中表现良好,适合用于高速信号应用,如RF通信和脉冲信号处理。
  5. 工作温度范围
    BC846S,115的工作温度范围可达150°C(TJ),这使得它非常适合于高温环境下的应用,如工业自动化设备及汽车电子系统,提高了设计的安全性和容错能力。

  6. 封装和安装类型
    该产品采用6-TSSOP封装,具备表面贴装能力(Surface Mount Technology, SMT),适合现代电子设备的小型化需求。此外,这种封装有助于提升热管理效能和降低安装空间。

应用场景

BC846S,115适用于以下应用领域:

  • 消费电子:如音频放大器、LED驱动电路、音频信号开关等,利用其优异的增益特性和较低的饱和压降。
  • 通信设备:在调制解调器、小型基站和无线通讯模块中,用于高频信号放大和开关。
  • 工业控制:用于自动化仪器的开关和放大器电路,确保设备的稳定性和可靠性。
  • 汽车电子:适用于传感器接口和小功率开关,满足汽车工作环境的高温要求。

总结

BC846S,115凭借其优异的电流与电压特性、低饱和压降及高频响应,使其成为众多电子应用中的理想选择。在当今对器件小型化及高性能要求不断提升的市场需求下,BC846S,115的多功能特性可以有效满足工程师的设计需求,是现代电子设计中不可或缺的关键组件之一。

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