Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Nexperia 74HC4052D,653 74HC4052D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Nexperia 74HC4052D, 653
- Type
- NEXPERIA
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- NEXPERIA
- Electronic Component
- 74HC4052D,653
- Electronic Component
- 1
- Package
- SOIC-16
- Electronic Component
- 180MHz
- Electronic Component
- Analog Switch / Multiplexer
- Electronic Component
- 0.275g
- Electronic Component
- 1
- Channel Count
- 2
- Features
- Level Conversion
- Electronic Component
- BM0000279175
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 2V~10V
- Switch
- 4:1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
74HC4052D,653 产品概述
74HC4052D,653 是一款高性能的多路复用器/解复用器，属于经典的74系列逻辑芯片。该设备采用先进的CMOS工艺，具有低功耗、快速开关速度和宽工作电压范围，使其在各种现代数字电路应用中都能够发挥出色的性能。安世(Nexperia)作为该产品的生产厂家，确保了其高质量和可靠性，是电子设计工程师和开发者的理想选择。
主要特性
多路复用功能：74HC4052D具备4：1的多路复用/解复用能力。这使得该芯片能够在单个封装中接收来自四个输入的信号，并选择其中一个输出，极大地提高了系统的灵活性和可扩展性。
开关电路配置：该芯片支持SP4T（单极四通道）开关配置，能够在多种应用中有效切换信号路径，适用于各种信号处理和通信系统。
高带宽性能：该设备拥有高达180MHz的-3dB带宽，能够满足高频信号传输需求，确保在数据采集、视频处理等高速数字信号应用中的表现。
低导通电阻和高通道匹配：最大导通电阻为150Ω，通道至通道匹配（ΔRon）为6Ω，能够有效降低信号衰减和失真，保证信号的完整性，对高精度信号处理尤为重要。
低漏电流：在关断状态下，最大漏电流仅为2µA，降低了功耗，适用于便携式设备。
广泛的工作温度范围：该器件的工作温度范围为-40°C至125°C，适合于多种恶劣环境下的应用，能够确保稳定的性能。
小型封装：74HC4052D采用16-SOIC封装（0.154"，3.90mm宽），便于集成于各种电路板设计中，节省空间，提高整体系统的集成度。
优异的串扰特性：在1MHz频率下的串扰达到了-60dB，确保在多路信号处理时，各通道之间的干扰极小，维护了信号的独立性和清晰度。
应用场景
由于其独特的参数特性，74HC4052D,653 是许多应用的理想选择，包括但不限于：
- 音频与视频切换设备：在多路音频或视频信号处理系统中作为开关使用。
- 数据采集系统：在需要选择多个信号源进行监测或采集时，作为多路复用器使用。
- 通信系统：在无线和有线通信系统中用于信号切换和选择，以提高信号处理的灵活性。
- 定制电子产品：在各种定制的电子产品设计中，能够提供高效、低功耗的信号管理方案。
总结
74HC4052D,653 作为一款高效的多路复用器/解复用器，凭借其出色的性能特性和广泛的适用性，已成为许多现代电子设计中的核心组件。其低功耗、高速度和优良的信号完整性，为工程师带来了设计灵活性与效率。无论是在专业应用还是更广泛的消费电子领域，74HC4052D都展现出其独特的价值。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
