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Nexperia BAS16-QR BAS16
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Nexperia BAS16-QR
- Type
- NEXPERIA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NEXPERIA
- Electronic Component
- BAS16-QR
- Electronic Component
- 1
- Package
- SC-90
- Electronic Component
- Switch Diode
- Electronic Component
- 0.06g
- Electronic Component
- 1
- Electronic Component
- BM0229987516
- Current
- 215mA
- Diode
- 1
- Current(Ir)
- 500nA
- (Vf)
- 1.25V@150mA
- Power Dissipation(Pd)
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS16-QR 产品概述
一、产品简介
BAS16-QR 是 Nexperia（安世）推出的一款小信号快速恢复二极管，单只封装，体积微小，适合高密度表贴电路。器件在低电流快速切换场合表现良好，同时具备较高的反向耐压，适用于多种电子系统中的信号整流与开关应用。
二、主要电气参数
- 正向压降 Vf = 1.25 V @ 150 mA：在中等电流下正向压降低，有利于减小功耗与发热。
- 直流反向耐压 Vr = 100 V：能够承受较高工作电压，适合高压小信号场合。
- 整流电流 If(均方) = 215 mA：适合小信号整流与持续低功率负载。
- 耗散功率 Pd = 250 mW：封装限流能力有限，设计时需注意热耗散与功率热降额。
- 反向电流 Ir = 500 nA（典型）：漏电流很小，有利于高阻抗节点与精密电路。
- 反向恢复时间 Trr = 4 ns：快速恢复，适合高频开关与脉冲应用。
- 非重复峰值浪涌电流 Ifsm = 4 A：短时浪涌能力良好，可耐受焊接或瞬态冲击。
三、封装与热管理
封装为 SC-90（超小体积表贴），适合高密度 PCB 布局。由于封装体积小，热阻较大，器件功耗受限，实际使用时应通过 PCB 铜箔散热、短走线与必要的热浇注（thermal vias）降低结壳温度，保证在额定电流下长时间可靠工作。
四、典型应用场景
- 高速开关与信号整形电路（因 Trr=4ns）。
- 小信号整流与耦合/解耦电路。
- 电压钳位、反向保护与 steering diode。
- 混频、检波以及射频前端的信号处理（低漏电、快恢复）。
- 移动设备与消费电子中对空间和功耗敏感的电路。
五、选型与设计注意事项
- 若工作电流接近 150–215 mA，应关注 Vf 产生的功耗与封装 Pd 限制，必要时设计热降额或选择更大封装。
- 在高温条件下 Ir 会上升，精密或高阻节点需评估漏电对系统影响。
- 高频快速开关应用时，关注 Trr 与电路的反射/压摆，必要时做实际测量验证。
- 如果需承受长期较大电流，优先考虑更高 Pd 与更大封装的器件。
- 订购时以完整型号 BAS16-QR、厂商 Nexperia（安世）与封装 SC-90 为准，并核对规格书上的绝对极限值与封装尺寸。
六、总结
BAS16-QR 在尺寸、耐压与开关速度之间取得了良好平衡，适合对体积和切换性能有要求的小信号应用。但因封装限功率较低，热管理与电流等级是设计时必须重点考虑的因素。建议在最终设计中参照 Nexperia 官方数据手册进行详细仿真与热评估。
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