WMSIC Electronic Components

LM75AD,118 LM75AD

ModelLM75AD,118
PackageSOIC-8
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP LM75AD, 118
Type
NXP
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
LM75AD,118
Electronic Component
1
Package
SOIC-8
Electronic Component
Temperature Sensor
Electronic Component
±2℃
Electronic Component
0.193g
Electronic Component
1
Features
Comparator / Output; Output; Low Power
Electronic Component
BM0094318042
Operating Voltage
2.8V~5.5V
Interface Type
I2C
Electronic Component
55℃~+125℃
Resolution
11bit

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM75AD,118 产品概述

制造商背景
LM75AD,118 是由荷兰半导体制造商 NXP USA Inc. 生产的一款数字温度传感器。NXP 是全球领先的半导体公司,以其创新的技术和高性能的产品在市场中占据一席之地。其产品广泛应用于汽车、工业、消费电子和通信等领域。

产品概述
LM75AD,118 是一种高精度的数字温度传感器,能够在极广泛的温度范围内(-55°C 至 125°C)进行测量。该传感器采用 I²C 输出接口,方便与微控制器和其他数字电路进行通信,同时支持卷带(TR)包装,便于大规模生产和自动化贴装。

技术参数

  • 感应温度范围: LM75AD,118 的工作温度范围从 -55°C 到 125°C,适用于各种极端环境。
  • 分辨率和精度: 该传感器的分辨率为 11 位,最高可达 ±2°C 的精度,最低为 ±3°C,确保了测量数据的可靠性和精确性。
  • 供电电压: LM75AD,118 的供电电压范围为 2.8V 至 5.5V,能够适应多种电源环境。
  • 输出类型: 该器件通过 I²C 接口输出数据,支持多个从设备连接,简化了系统设计。
  • 额外特性: LM75AD,118 具有可编程极限、可编程分辨率和关断模式等功能,用户可以根据具体应用的需求进行配置,提升了灵活性与适应性。

应用场景
LM75AD,118 由于其优越的性能和高可靠性,在众多领域都有广泛的应用。其主要应用场景包括:

  1. 消费电子: 该传感器能够用于家电、计算机及可穿戴设备等电子产品中,通过实时监测温度参数,提升设备运行的稳定性和安全性。

  2. 工业控制系统: 在自动化生产和工业监控系统中,LM75AD,118 可用于监测机器或设备的温度变化,及时做出反应以防止设备过热,保障设备及人员的安全。

  3. 汽车电子: 该传感器在汽车环境中也能发挥重要作用,例如车载空调系统的温度控制、引擎管理等,确保汽车在不同环境下都能正常运作。

  4. 医疗设备: 在医疗器械中,LM75AD,118 可以用于监控患者体温或药物存储温度,确保医疗环境的温度满足行业标准。

封装与安装
LM75AD,118 采用 8-SOIC 封装,尺寸为 0.154 英寸(3.90mm 宽),非常适合表面贴装技术(SMT),便于集成在各种电路板上。该封装设计不仅可以节省空间,还能够提高整体设备的性能和可靠性。在量产及自动化贴装方面,卷带(TR)包装形式也便于实现高效的生产过程。

总结
LM75AD,118 数字温度传感器以其宽广的工作温度范围、高精度和多种灵活的特性,使其成为许多应用领域中不可或缺的组件。NXP 作为全球知名的半导体制造商,凭借其强大的技术实力和丰富的行业经验,确保了 LM75AD,118 能够满足用户对高性能传感器的需求。无论是在消费电子、工业自动化,还是医疗设备中,LM75AD,118 都能提供可靠的温度监测解决方案,是各类应用中理想的选择。

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