Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
制造商背景
LM75AD,118 是由荷兰半导体制造商 NXP USA Inc. 生产的一款数字温度传感器。NXP 是全球领先的半导体公司,以其创新的技术和高性能的产品在市场中占据一席之地。其产品广泛应用于汽车、工业、消费电子和通信等领域。
产品概述
LM75AD,118 是一种高精度的数字温度传感器,能够在极广泛的温度范围内(-55°C 至 125°C)进行测量。该传感器采用 I²C 输出接口,方便与微控制器和其他数字电路进行通信,同时支持卷带(TR)包装,便于大规模生产和自动化贴装。
技术参数
应用场景
LM75AD,118 由于其优越的性能和高可靠性,在众多领域都有广泛的应用。其主要应用场景包括:
消费电子: 该传感器能够用于家电、计算机及可穿戴设备等电子产品中,通过实时监测温度参数,提升设备运行的稳定性和安全性。
工业控制系统: 在自动化生产和工业监控系统中,LM75AD,118 可用于监测机器或设备的温度变化,及时做出反应以防止设备过热,保障设备及人员的安全。
汽车电子: 该传感器在汽车环境中也能发挥重要作用,例如车载空调系统的温度控制、引擎管理等,确保汽车在不同环境下都能正常运作。
医疗设备: 在医疗器械中,LM75AD,118 可以用于监控患者体温或药物存储温度,确保医疗环境的温度满足行业标准。
封装与安装
LM75AD,118 采用 8-SOIC 封装,尺寸为 0.154 英寸(3.90mm 宽),非常适合表面贴装技术(SMT),便于集成在各种电路板上。该封装设计不仅可以节省空间,还能够提高整体设备的性能和可靠性。在量产及自动化贴装方面,卷带(TR)包装形式也便于实现高效的生产过程。
总结
LM75AD,118 数字温度传感器以其宽广的工作温度范围、高精度和多种灵活的特性,使其成为许多应用领域中不可或缺的组件。NXP 作为全球知名的半导体制造商,凭借其强大的技术实力和丰富的行业经验,确保了 LM75AD,118 能够满足用户对高性能传感器的需求。无论是在消费电子、工业自动化,还是医疗设备中,LM75AD,118 都能提供可靠的温度监测解决方案,是各类应用中理想的选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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