WMSIC Electronic Components

PCF85363ATT/AJ PCF85363ATT

ModelPCF85363ATT/AJ
PackageTSSOP-8
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP PCF85363ATT / AJ
Type
NXP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCF85363ATT/AJ
Electronic Component
1
Package
TSSOP-8
Electronic Component
Real-Time Clock (RTC)
Electronic Component
0.25g
Electronic Component
1
Features
Gate; Power Management and Battery;; SRAM / NVRAM;; Output; Programmable Clock Output
Electronic Component
BM0233535814
Operating Temperature
40℃~+85℃
Operating Voltage
900mV~5.5V
Operating Current
280nA
Interface Type
I2C
Crystal Oscillator Type
Built-in
Output
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCF85363ATT/AJ 产品概述

一、产品简介

PCF85363ATT/AJ 是恩智浦(NXP)推出的一款超低功耗实时时钟(RTC)芯片,集成时钟与日历功能、闹钟输出与内部晶振电路,采用标准 I²C 两线串口便于与微控制器连接。器件工作电压范围宽(0.9V–5.5V),工作温度覆盖工业级(-40℃ 到 +85℃),并提供微安级以下的待机与运行电流,非常适合电池供电与能量受限的系统。

二、主要特性

  • 实时时钟与日历:提供秒、分、时、日、周、月、年等基本时间与历法管理,满足常见时间计时需求。
  • 闹钟输出:内置闹钟/事件输出,可作为系统中断或唤醒源用于低功耗唤醒设计。
  • 低功耗特性:工作电流典型值为 280 nA,静态电流(Iq)约 0.28 μA,适合长期电池备份应用。
  • 宽电源电压:支持 0.9V 至 5.5V 的供电范围,可与单节锂电池或常见系统电压直接匹配。
  • 内置晶振电路:封装内置晶振相关电路,简化外部元件需求与系统布局(请参阅器件手册确认晶体/谐振器连接要求)。
  • I²C 接口:标准 2 线串行接口,易于与各类 MCU/SoC 协同工作并在主流系统中快速集成。
  • 片上存储:具备 64 字节的用户存储,用于保存配置或小量数据(64B),提高系统灵活性。
  • 工业级工作温度:-40℃ 至 +85℃,适用工业与户外应用场景。
  • 封装:TSSOP-8(另有 MSOP 等小封装形式),适合空间受限的 PCB 设计。

三、电气与热特性

  • 工作电压(VDD):0.9 V 至 5.5 V,支持低压启动与宽范围供电。
  • 工作电流:约 280 nA(典型,视工作模式与输出状态而定)。
  • 静态电流(Iq):约 0.28 μA(典型)。
  • 工作温度:-40℃ 至 +85℃。
    (以上参数为器件典型值,请以官方数据手册中的电气特性曲线与表格为准,并在最终设计中预留裕量。)

四、功能说明

  • 时间保持与闹钟:芯片提供标准的实时时钟/日历寄存结构,并支持至少一个可编程闹钟,可通过闹钟输出产生外部中断用于微控制器唤醒或事件记录。
  • 用户存储:64B 的片上 RAM 可用于存放配置参数、校准值或小量日志数据,掉电后可通过备份电源维持。
  • 低功耗唤醒:结合闹钟输出与 I²C 通讯,可在保持极低功耗的待机态下仅在必要时唤醒主处理单元,延长电池寿命。
  • 接口与兼容性:标准 I²C 两线接口,便于与各种 MCU/MPU 互连,常见的上拉电阻与通信协议均可兼容。

五、封装与布局建议

  • 封装类型:TSSOP-8(0.118" / 3.00 mm 宽)为常用选项,另有更小外形如 MSOP 可供选择;封装选择应考虑散热、焊接工艺与空间约束。
  • 布局建议:靠近电源引脚配置去耦电容,I²C SDA/SCL 线上使用合适的上拉电阻并尽量缩短走线以降低干扰。晶振/外部谐振器(如需要)按数据手册推荐的布局与地平面处理,确保时钟精度与启动可靠性。
  • 备份电源:若需保持 RTC 在主电源断电时仍然运行,建议预留备用电池或超级电容接口,并按手册规范配置二极管或电源管理器件以实现无缝切换。

六、典型应用场景

  • 电池供电设备:数据记录仪、远程传感器、可穿戴设备、便携式仪表等。
  • 工业与楼宇控制:计时任务、事件记录与定时唤醒的控制器与计费应用。
  • 智能家居与物联网节点:低功耗定时唤醒与时间标记功能,可延长节点电池寿命并简化时钟管理。
  • 电子计时和日历设备:需要高可靠性、长寿命电池备份的时钟与日历解决方案。

七、总结

PCF85363ATT/AJ 凭借超低功耗、宽电压范围、工业温度等级与集成闹钟与片上存储,适合对功耗敏感且需要稳健时间管理的嵌入式系统。其标准的 I²C 接口与小尺寸封装便于系统集成与量产应用。欲获得详细寄存器定义、电气规格曲线及布局示意,请参考恩智浦官方数据手册与参考设计文档。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.