Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PCF8574AT/3,518 PCF8574AT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP PCF8574AT / 3, 518
- Type
- NXP
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- PCF8574AT/3,518
- Electronic Component
- 1
- Package
- SOIC-16-300mil
- Electronic Component
- I / O Expander
- Electronic Component
- 0.596g
- Electronic Component
- 1
- I / O
- 8
- Features
- Built-in LEDDriver; positions; and
- Electronic Component
- BM0221332604
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.5V~6V
- Interface Type
- I2C
- Current(IOH)
- 300uA
- Current(IOL)
- 25mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PCF8574AT/3,518 产品概述
概述
PCF8574AT/3,518 是一款由恩智浦(NXP)推出的 I²C I/O 扩展器，具有8个可编程的双向输入/输出通道，采用16-SO封装设计。该器件广泛应用于各种需要扩展 GPIO 接口的场合，特别是在资源受限的环境中，如小型嵌入式系统、传感器应用及工业控制等。它的工作电压范围为 2.5V 到 6V，适合于多种电源环境。
特性
PCF8574AT/3,518 的主要特性包括：
工作电压范围：该器件可以在 2.5V 至 6V 的电压下正常工作，使其适用于多种电源电压的场合。它的广泛电压适应性也提高了其与诸多系统的兼容性。
电流输出：该器件的输出电流能力为300µA (灌)和25mA (拉)，适合驱动各种低功耗外设如 LED 灯和小型继电器。
输出类型：PCF8574AT/3,518 支持推挽式输出模式，能够提供较高的输出驱动能力与更快的信号响应时间。
工作温度范围：该器件的工作温度范围在 -40°C 至 85°C 之间，确保其在恶劣环境条件下的稳定性能，适合工业、汽车及户外设备的应用。
时钟频率：支持的最大 I²C 时钟频率为 100kHz，满足大部分低速通信需求。
表面贴装型：其表面贴装型(SMD)封装方便集成于现代PCB设计中，帮助实现高密度、小型化的电路板设计。
中断输出：PCF8574AT/3,518 提供中断输出功能，有助于实现高效的数据传输和状态监测，减少CPU干预，提高系统响应速度。
应用场景
PCF8574AT/3,518 的设计使其在多种电子应用中均表现出色。以下是一些典型的应用场景：
嵌入式系统：在微控制器资源有限的情况下，可以通过PCF8574扩展大量的GPIO端口，满足按钮输入、LED指示、传感器接口等需求。
工业自动化：在许多工业控制项目中，该器件能够用来监测状态信号和控制执行器，例如电机控制及状态指示灯。
汽车电子：其广泛的工作温度范围使得PCF8574AT/3,518能够在汽车内的各种环境条件下持续工作，例如用于车载计算机的接口扩展。
消费电子：在家用电器等设备中，可以用于控制电源、获取用户输入（如按键阵列）及外部活动监测。
智能家居：在智能家居控制系统中，能够与传感器、开关及其他外设进行灵活的接口操作。
结论
PCF8574AT/3,518 是一款功能强大且灵活的 I²C I/O 扩展器，凭借其广泛的电压范围、灵活的输出特性及优异的工作温度特性，非常适合现代电子设备的需求。无论是在工业控制、汽车电子还是消费电子领域，PCF8574AT/3,518 都能够为设计师提供极大的便利与灵活性，帮助他们在资源有限的条件下，实现高效能的电路设计。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
