WMSIC Electronic Components

PCA9545APW,118 PCA9545APW

ModelPCA9545APW,118
PackageTSSOP-20
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP PCA9545APW, 118
Type
NXP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCA9545APW,118
Electronic Component
1
Package
TSSOP-20
Electronic Component
I2C
Electronic Component
Analog Switch - Special Purpose
Electronic Component
0.119g
Electronic Component
1
Features
Analog;; Level Conversion;;; Interface Integrated
Electronic Component
BM0264915995
Operating Temperature
40℃~+85℃
Operating Voltage
2.3V~5.5V
Switch
4:1
(tpd)
300ps
Resistor(Ron)
11Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCA9545APW,118 4通道I²C开关产品概述

一、产品定位与核心功能

PCA9545APW,118是恩智浦(NXP)推出的4通道双向I²C多路选择开关,核心作用是解决I²C总线系统中“从设备地址冲突”与“通道数量不足”问题。它采用1个主I²C通道+4个从I²C通道的4:1切换架构,通过主控制器发送I²C控制指令,可选择4个从通道中的任意一个与主通道双向导通,其余通道保持断开,实现单主设备对多从设备的有序访问——无需修改从设备硬件地址,也无需额外增加总线接口,大幅简化系统设计。

二、关键性能参数深度解析

该产品的参数针对I²C总线实际需求优化,核心指标适配多场景:

  1. 宽电压兼容:工作电压覆盖2.3V~5.5V,兼容3.3V主流微控制器与5V传统电路,无需电平转换模块,降低系统复杂度;
  2. 低导通电阻:通道导通电阻典型值11Ω,可减少I²C信号传输衰减,保证10米内长距离传输的信号完整性,避免通信误码;
  3. 高速传播延迟:信号传播延迟仅300ps,支持1MHz以上高频I²C通信,满足实时数据采集等高速场景;
  4. 工业级温度范围:工作温度-40℃~+85℃,适应工业现场低温(如北方户外设备)与高温(如机箱内部)工况,可靠性满足工业标准;
  5. 双向传输支持:I²C的SDA、SCL均为双向线,该产品4个从通道均支持双向信号,无需区分输入输出,完全适配I²C协议特性。

三、典型应用场景适配

PCA9545APW的设计特性使其覆盖多领域:

  1. 工业传感器网络:工业现场常需采集4个同型号PT100温度传感器,但默认地址相同无法并联。通过该开关,主控制器可依次切换连接每个传感器,实现有序数据采集,简化布线;
  2. 消费电子多外设扩展:智能冰箱需连接显示屏、湿度传感器、温度传感器等,地址可能重叠。该开关整合外设到同一总线,减少控制器I²C接口数量,降低成本;
  3. 通信设备状态监测:路由器、交换机需监测4个模块的电源电压、温度,但模块监测芯片地址相同。该开关让主CPU切换访问每个模块,实时获取状态数据;
  4. 小型化便携设备:穿戴设备、便携医疗设备对体积要求严格,TSSOP-20封装(5.3mm×4.4mm)可嵌入紧凑空间,同时扩展多I²C外设。

四、封装与可靠性设计

  1. TSSOP-20封装优势:薄型小尺寸封装,引脚间距0.65mm,体积仅为传统DIP的1/3,适合高密度PCB;贴片式支持自动化焊接,生产效率高;
  2. 可靠性保障:恩智浦工业级设计赋予抗干扰能力,ESD防护(HBM≥2kV)抵抗工业静电冲击;具备过流保护,避免通道短路损坏设备。

五、品牌与选型优势

作为恩智浦成熟产品,该开关具备明显优势:

  1. 品牌可靠性:恩智浦是全球知名半导体厂商,产品通过ISO9001认证,供货稳定,满足批量生产需求;
  2. 协议兼容性:完全兼容I²C标准协议,主控制器无需修改驱动,仅需增加通道选择指令,开发周期短;
  3. 低功耗设计:静态电流典型值2μA(2.5V下),适合电池供电便携设备,延长续航。

总结:PCA9545APW,118通过4:1通道切换、宽电压兼容、工业级可靠性,成为解决I²C总线扩展与地址冲突的理想选择,覆盖工业、消费电子、通信等多领域。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.