WMSIC Electronic Components

PCF2129AT/2,518 PCF2129AT

ModelPCF2129AT/2,518
PackageSOIC-20-300mil
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP PCF2129AT / 2, 518
Type
NXP
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCF2129AT/2,518
Electronic Component
1
Package
SOIC-20-300mil
Electronic Component
Real-Time Clock (RTC)
Electronic Component
0.69g
Electronic Component
1
Features
Battery;; and; Power Management and Battery;; Output; Programmable Clock Output; Gate
Electronic Component
BM0241195895
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~4.2V
Operating Current
700nA
Interface Type
I2C
Crystal Oscillator Type
Built-in
Output
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCF2129AT/2,518 产品概述

一、产品简介

PCF2129AT/2,518 是恩智浦(NXP)推出的一款低功耗实时时钟(RTC)芯片,采用标准 I²C 两线串行接口,集成晶振源并带有闹钟输出。器件针对需长时间电池待机、精确时钟保持的嵌入式与工业应用设计,工作电压宽范围、低静态电流和工业级温度范围,使其适用于多种供电与环境条件。

二、主要特性

  • 接口类型:I²C(2 线串口),便于与大多数微控制器连接
  • 工作电压:1.8 V ~ 4.2 V,支持单电池及常见系统电压
  • 工作电流(典型):700 nA,静态电流(Iq)约 0.7 μA,极低功耗利于电池寿命延长
  • 晶振:内置,无需外置 32.768 kHz 晶体,减少外部元件与BOM成本
  • 闹钟输出:集成闹钟输出,用于系统唤醒或中断通知
  • 工作温度:-40 ℃ ~ +85 ℃,满足工业级温度需求
  • 封装:SOIC-20 (300 mil / 0.295" / 7.50 mm 宽),便于插板与自动贴装工艺

三、电气参数要点

PCF2129AT/2,518 在 1.8 V 至 4.2 V 范围内稳定工作,对低电压系统友好。极低的静态电流(约 0.7 μA)和工作电流(约 700 nA)使其在电池供电、待机时间长的设备中能够显著降低电量消耗。I²C 总线要求标准上拉电阻,请根据系统电压选择合适阻值。

四、功能与典型应用

  • 时钟与日历:提供连续秒/分/时/日/月/年等时钟日历功能,常用于系统时间戳与时间调度
  • 闹钟/唤醒:闹钟输出可驱动外部中断,实现定时唤醒与定时任务触发
  • 典型应用场景:便携式设备、物联网终端、数据采集器、智能表计、工控设备与消费类产品等需要精准、低功耗时间保持的场合

五、封装与机械信息

采用 SOIC-20-300mil 封装(0.295" / 7.50 mm 宽),适配通用 PCB 布局与插装工艺。封装利于原型开发与量产,同时在空间允许时便于散热与焊接可靠性控制。

六、设计与使用建议

  • 电源与电池:确保主供电与备用电池(如钮扣电池)切换逻辑可靠,避免电源翻转导致寄存器异常;在 1.8 V 至 4.2 V 范围内选择稳定电源;使用旁路电容(如 0.1 μF)靠近 VCC 引脚以抑制噪声。
  • I²C 总线:为 SDA/SCL 添加合适的上拉电阻,考虑总线速度与总线长度并优化阻值;上电/掉电序列需遵守芯片规范以防通信异常。
  • 时钟与闹钟:利用闹钟输出实现低功耗唤醒时,注意 MCU 的唤醒电平与中断配置,必要时配合硬件滤波抑制毛刺。
  • 布局注意:靠近芯片放置去耦电容,避免高频信号线穿越 RTC 区域以减少干扰;遵循厂家参考电路与 PCB 指南以保证时钟稳定性。

总结:PCF2129AT/2,518 以其内置晶振、超低功耗和 I²C 接口,适合对电池寿命与可靠性有较高要求的时钟保持应用。选择时应结合系统电源、唤醒策略及 PCB 布局进行综合设计以发挥最佳性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.