WMSIC Electronic Components

NTS0102DP,125 NTS0102DP

ModelNTS0102DP,125
PackageTSSOP-8
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP NTS0102DP, 125
Type
NXP
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
NTS0102DP,125
Electronic Component
1
Package
TSSOP-8
Electronic Component
Converter / Level positions
Electronic Component
0.059g
Electronic Component
1
Electronic Component
BM0231096210
Operating Temperature
40℃~+125℃
Data
50Mbps
Output Type
Electronic Component
Type
Electronic Component
Operating Voltage(VCCA)
1.65V~3.6V
Operating Voltage(VCCB)
2.3V~5.5V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NTS0102DP,125 产品概述

一、产品简介

NTS0102DP,125 是恩智浦(NXP)推出的一款双向电平转换器,单片包含 2 路电路、每路 2 通道(共 2 个双向通道),以 TSSOP-8 封装交付。器件支持自动方向检测、三态输出和断电保护,典型数据速率可达 50 Mbps,适用于不同电压域之间的高速数字信号互联。

二、主要性能参数

  • 通道类型:双向(自动方向检测)
  • 数据速率:最高 50 Mbps(典型)
  • 电源电压:VCCA = 1.65 V ~ 3.6 V;VCCB = 2.3 V ~ 5.5 V
  • 每个器件电路数:2(每电路 2 通道)
  • 输出类型:三态(带使能/禁能控制)
  • 工作温度:-40 ℃ ~ +125 ℃
  • 特性:断电保护(Ioff)、自动方向检测、低功耗

三、功能与行为说明

NTS0102 通过内部电路自动判断信号传输方向,无需额外方向控制信号,降低布线和固件复杂度。器件具备三态使能功能,可在需要时将通道置为高阻态,便于总线共享或系统上电/下电管理。断电保护特性保证在单侧电源缺失时,不会出现 IO 端向未上电侧回流的风险,提高系统可靠性。

四、典型应用场景

  • 不同电压 MCU、FPGA、CPLD 与外设之间的信号接口(例如 1.8 V ↔ 3.3 V、1.8 V ↔ 5 V 等)
  • SPI、UART、GPIO 等点对点或点对多点数字接口电平匹配
  • 工业总线接口和嵌入式系统的电源域隔离与互通 (注:对于需要总线仲裁或开漏特性的 I2C,请确认器件对开漏/上拉兼容性或考虑专用 I2C 翻译器)

五、设计与选型建议

  • 电源:为 VCCA、VCCB 各自配置 0.1 µF 陶瓷去耦电容,尽量靠近引脚布置,减小电源噪声与瞬态。
  • PCB 布局:信号走线尽量短且匹配阻抗,避免长走线引起串扰或反射,50 Mbps 速率下要注意终端与阻抗控制。
  • 使能/三态:在系统设计中合理使用使能引脚控制器件工作状态,以实现电源顺序与热插拔的安全管理。
  • 断电保护:器件内置 Ioff,可在单侧电源断电时防止接口回流,但仍需在系统级考虑电源顺序与保护元件。
  • 温度与封装:器件工作温度范围宽,适合工业级应用。TSSOP-8 封装有利于节省 PCB 面积。

六、封装与选型信息

  • 封装:TSSOP-8(小型化,适合高密度电路板)
  • 型号示例:NTS0102DP,125(请参照官方数据手册确认完整器件代码及可用性)
  • 采购与可靠性:选择合规供应渠道并参考恩智浦数据手册获取管脚定义、电气特性曲线和典型应用电路。

七、总结

NTS0102DP,125 是一款面向多电压域、高可靠性嵌入式系统的双向电平转换器,凭借自动方向检测、断电保护和三态控制等特性,能简化电平兼容设计并提升系统稳定性。适用于 MCU/FPGA 与外设高速数字信号互连,但在涉及总线型开漏信号(如 I2C)时应结合具体应用验证兼容性。建议在设计阶段参考官方数据手册并做好去耦与走线布局,以确保在 50 Mbps 速率下获得最佳性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.