WMSIC Electronic Components

PCA9555BS,118 PCA9555BS

ModelPCA9555BS,118
PackageHVQFN-24-EP(4x4)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
NXP PCA9555BS, 118
Type
NXP
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCA9555BS,118
Electronic Component
1
Package
HVQFN-24-EP(4x4)
Electronic Component
I / O Expander
Electronic Component
0.126g
Electronic Component
1
Features
positions; and
Electronic Component
BM0249882643
Electronic Component
Electronic Component
Electronic Component
6000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCA9555BS,118 产品概述

一、产品简介

PCA9555BS,118 是恩智浦(NXP)推出的一款 16 位 I²C/SMBus I/O 扩展器,支持最高 400 kHz 的快速模式通信。器件将两个 8 位并行端口整合在一颗芯片上,通过简单的 I²C 总线即可扩展 MCU 的 GPIO 数量,适用于需要大量通用输入/输出但主控引脚有限的场合。

二、主要功能和特点

  • 16 路独立可编程 I/O:每一路可独立配置为输入或输出,方向通过方向寄存器设置。
  • I²C/SMBus 接口:兼容标准模式和快速模式,最高支持 400 kHz。
  • 级联与地址扩展:器件提供地址选择引脚,可通过硬件地址线串联多达 8 片器件,从而扩展最多 128 路 I/O。
  • 复位功能:支持硬件复位,使寄存器恢复到默认状态,便于系统初始化与故障恢复。
  • 中断输出(开漏、低有效):当任一路输入状态变化时可触发中断,降低轮询开销并提高响应效率。
  • 极性翻转与寄存器访问:提供输入/输出寄存器、方向寄存器和极性翻转寄存器,便于软件灵活控制和判断引脚电平。

三、硬件接口与封装

PCA9555BS,118 采用 HVQFN-24-EP(4 x 4 mm)封装,带散热裸露焊盘,便于 PCB 散热与可靠焊接。器件通常工作电压范围宽(约 2.3 V 至 5.5 V),适配多电压系统。封装尺寸小且引脚排布紧凑,适合空间受限的嵌入式与消费类产品。

四、寄存器与使用要点

器件通过一组寄存器实现 I/O 管脚控制:输入端口寄存器、输出端口寄存器、方向寄存器和极性翻转寄存器。典型使用流程为配置方向→写输出→读取输入/监测中断。中断为开漏输出,应外接上拉至系统电源;复位后寄存器回到默认值,软件应在启动时完成必要的初始化配置。

五、典型应用场景

适用于键盘扫描、背光或指示灯驱动、按键矩阵、传感器信号采集、服务器与通信设备的远程 I/O 扩展,以及工业控制和家电等需要大规模 GPIO 扩展的场景。

六、设计与选型建议

在选型时关注总线地址规划(避免地址冲突)、上拉电阻值与中断线的负载能力,以及封装散热要求。若系统对瞬态保护有要求,建议在 I/O 线上添加限流或 TVS 器件。对于多片级联使用,应评估总线容量与上拉电阻对通信速度的影响。

总体而言,PCA9555BS,118 以其 16 路灵活可编程 I/O、快速 I²C 通信、级联扩展能力及小型 HVQFN 封装,为空间受限且需大量 GPIO 的设计提供了成熟可靠的扩展方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.