WMSIC Electronic Components

TEA19162T/2J TEA19162T

ModelTEA19162T/2J
PackageSO-8
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP TEA19162T / 2J
Type
NXP
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
TEA19162T/2J
Electronic Component
1
Package
SO-8
Type
PFCController
Electronic Component
PFC Controller
Electronic Component
0.158g
Electronic Component
1
Electronic Component
BM0258859550
Electronic Component
QR;DCM
Operating Current
800uA
Switching Frequency
148kHz
Current(IOH)
600mA
Current(IOL)
1.4A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TEA19162T/2J 产品概述

一、产品简介

TEA19162T/2J 是恩智浦(NXP)面向工业级开关电源的 AC‑DC 控制器/稳压器,采用表面贴装 SO‑8 封装。器件工作在间歇导电模式(DCM),典型开关频率为 134 kHz,适用于宽输入电压的离线辅助电源与小功率电源模块,工作温度范围为 -40°C 到 +150°C,适配严苛环境与高可靠性应用。

二、关键参数

  • 工作模式:间歇导电(DCM)
  • 开关频率:约 134 kHz
  • 启动电流:约 800 µA(低启动电流,利于节能与快速启动)
  • 供电电压范围:70 ~ 276 VAC(宽电压输入,支持全球电网)
  • 工作温度:-40°C ~ +150°C(工业级/汽车级附近温度等级)
  • 封装:8‑SOIC(0.154", 3.90 mm 宽,供应商器件封装 8‑SO)

三、主要特点与优势

  • 宽电压输入和低启动电流,使其适合直接从高压母线供电的辅助电源或待机电源设计;
  • DCM 工作方式有利于实现简单的控制回路、快速瞬态响应和较好的轻载效率;
  • 134 kHz 的开关频率在效率与磁性器件体积之间取得平衡,便于变压器与电感的合理设计;
  • SO‑8 封装便于自动贴片生产,适合中小功率模块化设计。

四、典型应用场景

  • 离线开关电源的控制与参考设计(如 1–10 W 辅助电源);
  • 工业控制电源、仪器仪表辅助供电;
  • 家电和照明电源的控制部分;
  • 对温度与可靠性要求较高的嵌入式系统备用电源。

五、设计要点与注意事项

  • EMI 与滤波:离线设计需注意输入滤波与共模抑制,合理布局以降低传导/辐射干扰;
  • 功率器件匹配:根据功率等级选择合适耐压与导通损耗的 MOSFET,注意开关损耗与散热;
  • 热管理:尽管器件耐高温,仍需评估 PCB 散热与周边元件温升,必要时增加散热措施;
  • 保护与稳定:合理设计过流、过压和启动电路,并进行环路补偿以保证系统稳定性。

六、总结

TEA19162T/2J 以其宽输入、低启动电流与 DCM 工作模式,适合用于要求高可靠性与紧凑设计的离线辅助电源与小功率开关电源。采用 SO‑8 封装便于批量生产和模块化设计,在工业、家电及嵌入式领域具有良好适配性。设计时关注 EMI、热管理与器件匹配,可获得稳定且高效的电源解决方案。

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