WMSIC Electronic Components

TEA2016AAT/2Y TEA2016AAT

ModelTEA2016AAT/2Y
PackageSOT-109-1
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP TEA2016AAT / 2Y
Type
NXP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
TEA2016AAT/2Y
Electronic Component
1
Package
SOT-109-1
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
0.225g
Electronic Component
1
Features
(SCP); (OTP);; (OVP); (UVP); (OCP)
Electronic Component
Electronic Component
Electronic Component
BM0252946955
Electronic Component
QR;DCM
Operating Temperature
40℃~+150℃
Operating Voltage
18.2V~19.7V
Switching Frequency
50kHz~200kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TEA2016AAT/2Y 产品概述

一、产品简介

TEA2016AAT/2Y 是恩智浦(NXP)面向高性能隔离式开关电源的专业电源管理控制器(PMIC),集成了 DCM/QR PFC 前端和谐振(Resonant)功率级控制功能。器件采用 SOT-109-1 封装,适用于对体积、效率和电磁兼容有严格要求的隔离式 AC‑DC/adapter 与家电电源设计。

二、主要特性

  • 隔离式设计,适合隔离输出电源架构。
  • 工作供电电压:18.2 V ~ 19.7 V(控制器工作范围参考)。
  • 开关频率范围:50 kHz ~ 200 kHz,便于在效率与体积之间权衡。
  • 耗散功率(Pd):700 mW,适用于小型封装热预算。
  • 器件内置高压晶体管,最高耐压可达 685 V,利于直接驱动高压开关结构。
  • 全面保护:过热保护(OTP)、欠压保护(UVP)、过压保护(OVP)、过流保护(OCP)。
  • 工作温度范围:-40 ℃ ~ +150 ℃,满足工业级可靠性要求。
  • 支持工作模式:准谐振(QR)与断续导通模式(DCM),兼顾软开关与瞬态响应。

三、功能与工作模式

TEA2016AAT/2Y 将 PFC 控制与谐振功率级控制集成在同一芯片中:前端 PFC 可在 DCM 或 QR 模式下工作,实现高功率因数与降低峰值电流;后端谐振控制支持软开关(准谐振)以降低开关损耗与电磁干扰。器件具备启动、欠压锁定与多种保护机制,能在异常工况下迅速保护系统并优雅重启。

四、典型应用与设计注意事项

  • 典型应用:笔记本/小型电源适配器、电视/机顶盒电源、LED 驱动与其他隔离式开关电源解决方案。
  • 频率选择:根据效率、变压器/谐振网络尺寸与 EMI 要求,在 50–200 kHz 区间优化工作点。
  • 热管理:由于器件 Pd 为 700 mW,建议在 PCB 布局中提供良好散热路径与铜面积,必要时配合散热垫或散热片。
  • 外围元件:谐振电感、电容与 PFC 电感需按目标功率与开关频率精确选型,确保软开关条件与稳定的环路响应。
  • 保护配置:利用器件内置 OTP/UVP/OVP/OCP 实现系统级保护,同时在方案中预留故障指示与重启策略。

五、封装与选型建议

TEA2016AAT/2Y 采用 SOT-109-1 紧凑封装,适合体积受限的应用。选型时应综合考虑输入电压范围、最大输出功率、谐振网络损耗与系统散热能力。最终设计请参照厂商数据手册获取引脚定义、典型应用电路与详细保护阈值,以保证电源系统的可靠性与性能。

总结:TEA2016AAT/2Y 以其集成的 DCM/QR PFC 与谐振控制、完善的保护功能和工业级温度范围,为追求高效率、低 EMI 和紧凑布局的隔离式开关电源提供了成熟且可靠的解决方案。若需量产或样机验证,请参考恩智浦官方资料并进行详细的电磁兼容与热设计评估。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.