WMSIC Electronic Components

PUYA P24C64C-TSH-MIR P24C64C

ModelP24C64C-TSH-MIR
PackageTSSOP-8
BrandPUYA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PUYA P24C64C-TSH-MIR
Type
PUYA
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PUYA
Electronic Component
P24C64C-TSH-MIR
Electronic Component
1
Package
TSSOP-8
Electronic Component
EEPROM
Electronic Component
0.086g
Electronic Component
1
Electronic Component
BM0264601930
Electronic Component
64Kbit
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz
Electronic Component
Electronic Component
Electronic Component
4000
(Tw)
5ms

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

P24C64C-TSH-MIR 产品概述

一、产品简介

P24C64C-TSH-MIR 是普冉(PUYA)推出的一款高可靠性串行 EEPROM,采用标准 I2C 接口,存储容量 64Kbit(8K × 8)。器件支持高达 1MHz 的总线时钟速率,适用于对非易失性参数、配置数据及小量日志保存有长期可靠性要求的嵌入式系统。器件以 TSSOP-8 小封装提供,便于 PCB 布局和空间受限的应用。

二、主要参数

  • 接口类型:I2C
  • 存储容量:64Kbit(8K × 8)
  • 时钟频率 (fc):最高 1MHz
  • 写周期时间 (Tw):典型 5ms(单页写入完成时间)
  • 数据保留 (TDR):100 年
  • 写周期寿命:1,000,000 次
  • 封装:TSSOP-8
  • 品牌:PUYA(普冉)

三、关键功能与优势

  • 页写保护功能:支持按页管理写入,便于保护关键数据区并提升写入效率。
  • 硬件写保护功能:提供硬件写保护引脚,可在系统需要时对全部或部分存储区进行物理保护,防止意外擦写或篡改。
  • 噪声抑制功能:内部具备抗干扰设计,改善在电磁噪声环境下的数据读写稳定性,适合工业及复杂电磁环境。
  • 高耐久与长期保存:百万次写周期与 100 年数据保持,适合需要极高可靠性的配置与校准数据保存。
  • 高速 I2C 兼容性:支持高达 1MHz 时钟,兼容标准 I2C 主控器,便于在既有总线系统中集成。

四、封装与引脚

器件以 TSSOP-8 小型封装提供,节省板上空间并利于自动化贴装。典型 TSSOP-8 引脚配置包含 VCC、GND、SDA、SCL、WP(硬件写保护)及地址/器件选择相关引脚,便于在多器件系统中通过地址线区分与管理(具体引脚定义请参照产品数据手册)。

五、应用场景与设计建议

适用场景:

  • 工业控制与自动化设备的参数保存
  • 智能家居与物联网终端的配置存储
  • 仪表与计量设备的校准参数保存
  • 消费电子的序列号、配置与小量日志

设计建议:

  • 在写入操作后遵循 Tw(约 5ms)或使用器件的写完成轮询(ACK)以确认写入完成,避免在写周期中断电。
  • 使用页写功能减少总线传输次数,提高写入效率并延长器件寿命。
  • 对敏感数据区启用硬件写保护(WP),并在 PCB 设计时为 WP 添加可控跳线以便调试与生产。
  • 在电源引脚附近增加去耦电容,并注意 I2C 总线的上拉电阻与线长控制,以发挥噪声抑制优势。

六、可靠性与使用注意

P24C64C-TSH-MIR 提供高达 100 年的数据保持与百万次写循环,适合长期部署与关键数据保存。实际使用中应注意满足电源、时序和写保护等规范,详情请参考官方数据手册和应用说明,以确保在目标环境下获得最佳可靠性与性能。若需批量选型或专项认证信息,建议与普冉(PUYA)或授权分销商联系获取最新技术支持与文档。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.