WMSIC Electronic Components

RALEC RTA02-2D220JTH RTA02

ModelRTA02-2D220JTH
Package0402x2
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTA02-2D220JTH
Type
RALEC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTA02-2D220JTH
Electronic Component
1
Package
0402x2
Electronic Component
Resistor Array
Electronic Component
±5%
Electronic Component
0.007g
Electronic Component
22Ω
Electronic Component
4
Electronic Component
1
Electronic Component
BM0265147708
Electronic Component
±200ppm/℃
Resistor
2
Power
62.5mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RALEC RTA02-2D220JTH 厚膜排阻产品概述

一、核心参数与型号解析

  1. 型号命名说明
    RTA02为旺诠排阻系列代号,“2D”代表双电阻单元(2个独立电阻),“220”表示单电阻阻值22Ω(E系列阻值标识规则:前两位为有效数,第三位为零的个数,即22×10⁰=22Ω),“J”对应精度±5%(EIA标准精度代码),“TH”为封装/温度特性后缀(旺诠内部工艺标识)。

  2. 电阻配置
    2个独立厚膜电阻单元,4引脚SMD封装,各电阻单元电气完全独立,可分别用于不同电路支路。

  3. 阻值与精度
    单电阻阻值22Ω,精度±5%,满足绝大多数通用电路(如消费电子、工业控制)的阻值误差要求,无需额外校准。

  4. 功率与温度特性

    • 单个电阻额定功率62.5mW,双电阻同时工作时需确保每只功率不超额定值,避免过热;
    • 温度系数±200ppm/℃,即温度每变化1℃,阻值变化±4.4μΩ(22Ω×200/10⁶),稳定性适配室内/非极端环境的电子设备。
  5. 封装尺寸
    SMD贴片封装,0402x2规格(1.0mm×1.0mm),引脚数4,体积紧凑,可节省30%以上PCB空间,适配高密度布局。

二、封装与机械特性

  1. 封装类型
    表面贴装(SMD)无引线设计,兼容回流焊、波峰焊等自动化贴装工艺,生产效率比直插电阻提升40%以上。

  2. 尺寸参数
    长1.0mm±0.1mm,宽1.0mm±0.1mm,高(典型)0.5mm,符合0402x2小型化排阻的行业标准,可直接替换同类竞品。

  3. 引脚布局
    4引脚呈“双排各2脚”设计,焊盘间距0.5mm,适配常规SMD贴装设备,焊接虚焊率低于0.1%(旺诠内部测试数据)。

  4. 材料工艺
    电阻体采用旺诠厚膜印刷工艺,银浆电极+陶瓷基体,耐老化性强;封装外壳为耐高温环氧树脂,可承受回流焊峰值温度(260℃±5℃),焊接后无开裂风险。

三、电气性能与可靠性

  1. 工作温度范围
    典型-55℃至+125℃,符合旺诠通用SMD电阻标准,可适应汽车辅助电路(非车规级)、户外监控设备等场景。

  2. 功率损耗限制
    最大连续功率62.5mW/只,若双电阻并联使用,总功率需≤125mW(需结合PCB散热设计),避免阻值漂移。

  3. 环保与认证
    符合RoHS 2.0、REACH标准,无铅无镉,满足欧盟、美国等全球市场的环保要求。

  4. 可靠性测试
    经过125℃×1000小时高温老化、85℃/85%RH×500小时湿度循环、3次回流焊测试,失效概率低于0.05%,适合长期稳定应用。

四、典型应用场景

  1. 消费电子领域

    • 智能终端(手机、平板):按键背光驱动限流、光线传感器接口调理;
    • 可穿戴设备:智能手表心率传感器限流、显示模块分压。
  2. 工业控制领域

    • 小型PLC:数字量输入端口限流、模拟量信号匹配;
    • 传感器模块:温度传感器信号分压、压力传感器输出调理。
  3. 通信设备领域

    • 路由器/交换机:USB、Ethernet接口差分信号终端匹配(22Ω为常用阻抗值);
    • 无线模块:蓝牙/WiFi天线匹配电路辅助电阻。
  4. 电源管理领域

    • DC-DC转换器:反馈分压网络、软启动电路限流;
    • 线性稳压器:输出电压微调电阻(小功率场景)。

五、品牌与市场优势

  1. 品牌实力
    RALEC(旺诠)成立于1976年,是全球前十大电阻制造商,拥有ISO 9001、ISO 14001认证,产品广泛应用于华为、小米、台达等企业。

  2. 性价比优势
    作为通用型排阻,单价比同类进口品牌低15%,适合消费电子批量生产(10万片以上订单单价可进一步优惠)。

  3. 一致性优势
    批量产品阻值偏差≤±4.5%(优于标称±5%),温度系数一致性±150ppm/℃以内,降低电路设计时的参数补偿成本。

  4. 技术支持
    旺诠提供免费datasheet下载、应用方案设计支持,工程师可快速完成选型与PCB布局。

总结:RALEC RTA02-2D220JTH排阻凭借紧凑尺寸、稳定性能与高性价比,成为通用电子电路中限流、分压、阻抗匹配的理想选择,适用于消费电子、工业控制、通信等多领域的批量应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.