WMSIC Electronic Components

RENESAS PS2801C-4-F3-A/N PS2801C

ModelPS2801C-4-F3-A/N
PackageSSOP-16-175mil
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS PS2801C-4-F3-A / N
Type
RENESAS
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
PS2801C-4-F3-A/N
Electronic Component
1
Package
SSOP-16-175mil
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.346g
Electronic Component
1
Electronic Component
7us
Electronic Component
BM0257410100
Operating Temperature
55℃~+100℃
Load Voltage
80V
Type
DC
Output Current
30mA
Output Type
Photoelectric Transistor
(tr)
5us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

瑞萨PS2801C-4-F3-A/N 晶体管输出光耦产品概述

PS2801C-4-F3-A/N是瑞萨电子(RENESAS)推出的四通道晶体管输出型光电耦合器,专为需要电信号隔离、抗干扰的电路场景设计,兼顾高可靠性、宽温适应性与紧凑封装,是工业控制、通信设备等领域的成熟解决方案。

一、产品核心定位

该光耦属于光电隔离器件,通过光信号实现输入与输出电路的电气隔离,核心作用是切断地环路干扰、保护低压控制电路免受高压侧冲击。作为四通道集成产品,它在单封装内整合4组独立的光耦单元,适合高密度PCB设计需求。

二、关键参数总览

从输入、输出、隔离到环境特性,产品参数覆盖核心应用需求:

  • 输入特性:直流(DC)输入,正向压降(Vf)典型值1.2V,最大正向电流(If)30mA;
  • 输出特性:光电三极管输出,集射极饱和电压(VCE(sat))≤130mV(负载电流10mA/2mA时),最大输出电流30mA,最大负载电压80V;
  • 隔离特性:交流隔离电压有效值(Vrms)2.5kV,直流反向耐压(Vr)6V;
  • 传输特性:电流传输比(CTR)最小值50%、最大值400%,上升时间(tr)5μs,下降时间(tf)7μs;
  • 环境特性:工作温度范围-55℃~+100℃,满足工业级宽温要求。

三、核心性能优势

1. 高隔离可靠性

2.5kV的交流隔离电压有效值,可有效隔离工业现场常见的1kV以上高压干扰(如电机驱动、电力线路);6V直流反向耐压防止输出端反向击穿,配合宽温设计(-55℃~100℃),能适应车间、户外等极端温度场景,长期运行稳定性可靠。

2. 稳定的信号传输

电流传输比(CTR)覆盖50%~400%的宽范围,既保证最小信号的有效传输(避免CTR过低导致信号丢失),又适配不同负载的驱动需求;5μs上升时间、7μs下降时间的快速响应,适合高速控制信号(如PLC脉冲信号、通信数据)的隔离传输。

3. 低损耗高效能

130mV的集射极饱和压降(轻载/重载下一致),大幅降低输出端的功率损耗,尤其适合低功耗设计场景(如电池供电的便携设备、节能型工业控制器),同时减少发热,提升器件寿命。

4. 紧凑多通道集成

采用SSOP-16-175mil封装,引脚间距175mil(约4.445mm),焊接兼容性好;单封装整合4组独立光耦,相比离散光耦节省50%以上的PCB空间,适合高密度电路(如小型PLC、通信模块)。

四、典型应用场景

1. 工业控制领域

  • PLC输入输出(I/O)隔离:隔离传感器信号与控制电路,防止现场高压(如220V/380V)串扰;
  • 电机驱动电路:隔离MCU控制信号与功率驱动模块,保护低压电路免受电机反电动势冲击;
  • 传感器信号调理:隔离温度、压力传感器的模拟/数字信号,提升测量精度。

2. 通信设备

  • 数据接口隔离:RS485、CAN总线的收发器隔离,切断共地干扰,保障长距离数据传输稳定性;
  • 电源与信号隔离:通信模块的电源隔离(如5V转3.3V)与信号隔离结合,提升抗干扰能力。

3. 消费电子与家电

  • 智能家电控制:空调、洗衣机的MCU与功率继电器隔离,防止继电器通断时的电磁干扰;
  • 电源适配器:低压输出端的信号隔离,提升用电安全性。

五、品牌与品质保障

瑞萨电子作为全球半导体行业领导者,PS2801C系列光耦经过严格的质量认证(如ISO/TS 16949、AEC-Q100等,部分版本),生产工艺成熟,批量一致性高;产品 datasheet 提供完整的可靠性测试数据(如温度循环、湿度老化),适合工业级批量应用。

该产品凭借高隔离、宽温、多通道与低损耗的综合优势,成为工业控制、通信等领域信号隔离的高性价比选择,可直接替代同类进口光耦,适配主流电路设计。

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