WMSIC Electronic Components

RENESAS PS2802-1-F3-A PS2802

ModelPS2802-1-F3-A
PackageSOIC-4-175mil
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RENESAS PS2802-1-F3-A
Type
RENESAS
Unit
Electronic Component
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
PS2802-1-F3-A
Electronic Component
1
Package
SOIC-4-175mil
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.139g
Electronic Component
1
Electronic Component
200us
Features
Output
Electronic Component
BM0231993393
Operating Temperature
55℃~+100℃
Load Voltage
40V
Type
DC
Output Current
90mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PS2802-1-F3-A 产品概述

一、简介

PS2802-1-F3-A 是瑞萨(RENESAS)推出的一款单通道晶体管输出光耦合器,采用达林顿晶体管输出结构,专为需要高电流传输比(CTR)和中等开关速度的直流隔离场合设计。器件输入为直流 LED,输出为达林顿晶体管,可实现低驱动电流下较大的输出能力与高隔离强度。

二、主要性能参数

  • 输入类型:DC(发光二极管)
  • 输出类型:达林顿晶体管(单通道)
  • LED 正向压降 Vf:典型 1.1 V
  • LED 正向电流 If:最大 50 mA(建议按规范使用)
  • LED 反向耐压 Vr:6 V
  • 输出集电极电流:最大 90 mA
  • 负载电压(输出端最大耐压):40 V
  • 隔离耐压:2.5 kVrms(绝缘安全等级)
  • 电流传输比 CTR:最小 200%,最大/饱和值 2000%(大范围 CTR,便于低驱动电流驱动)
  • 集—射极饱和电压 VCE(sat):≤1.0 V(在 IC=1~2 mA 条件下)
  • 开关速度:上升时间 tr ≈200 µs(@2 mA, 100 Ω);下降时间 tf ≈200 µs
  • 总功耗 Pd:120 mW
  • 工作温度范围:-55 ℃ 至 +100 ℃
  • 封装:SOIC-4(175 mil),4 引脚,单通道

三、主要特性与优势

  • 高隔离电压(2.5 kVrms),适用于需要安全隔离的系统设计。
  • 达林顿输出带来高 CTR,允许使用很小的 LED 驱动电流实现较大输出电流,降低驱动功耗。
  • 输出电流峰值可达 90 mA,能够驱动较大负载或后级开关元件。
  • 宽温度范围与工业级可靠性,适合严苛环境应用。
  • SOIC-4 封装便于 PCB 布局与波峰/回流焊处理,适合集成化生产。

四、典型应用

  • 电源管理与开关电路隔离控制(继电器、固态开关驱动)
  • 电机控制与工业自动化接口电路
  • 信号隔离、微控制器与高压侧之间的电平转换
  • 家电与消费电子中需要电气隔离的控制回路

五、封装与可靠性

器件采用 SOIC-4(175 mil)封装,四引脚布局,便于自动化贴装与焊接。产品在-55 ℃ 至 +100 ℃范围内长期工作,符合一般工业级温度与绝缘要求。请在高湿、高压与极端机械应力环境中参考厂商数据手册进行可靠性评估。

六、注意事项与推荐使用条件

  • 由于 CTR 范围较大(200%–2000%),在精密应用中需按实际批次测量或设计一定的裕量。
  • VCE(sat) ≤1 V 是在低电流条件下保证的典型值,较高负载电流时需关注功耗与热管理。
  • LED 反向耐压仅 6 V,安装与测试时避免反向高压冲击。
  • 推荐遵循瑞萨官方数据手册中的最大额定值与推荐工作点,以保证长期稳定性与安全隔离性能。

如需电气原理图示例、等效电路或详细引脚信息,可依据瑞萨 PS2802-1-F3-A 的数据手册获取更精确的设计参数与布局建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.