Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XINLUDA XA2179-S13 XA2179
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XINLUDA XA2179-S13
- Type
- XINLUDA
- Minimum package
- 3000 编带
Technical parameters
- P1dB
- 32dBm
- Electronic Component
- Electronic Component
- Electronic Component
- XINLUDA
- Electronic Component
- XA2179-S13
- Electronic Component
- 1
- Package
- SOT-363
- Electronic Component
- RFSwitch
- Electronic Component
- 0.037g
- Frequency
- 50MHz~3GHz
- Electronic Component
- 1
- Electronic Component
- 24dB
- Electronic Component
- BM0228559605
- Operating Temperature
- 45℃~+85℃
- Operating Voltage
- 2.5V~5.3V
- Electronic Component
- 0.4dB
- Circuit Structure
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XA2179-S13 产品概述
一、概述
XA2179-S13 是信路达（XINLUDA）推出的一款小尺寸、高性能射频开关/信号路径器件（产品分类未定）。其典型电气指标包括隔离度 24 dB、插入损耗 0.4 dB，工作电压范围 2.5 V 至 5.3 V，工作温度范围 -45 ℃ 至 +85 ℃。器件采用 SOT-363 小封装，适合空间受限的射频前端与便携类设备。
二、关键特性
- 隔离度：24 dB（低串扰、良好的关断性能，便于多通道/多天线系统布局）
- 插入损耗：0.4 dB（低损耗，有利于维持链路信噪比）
- 工作电压：2.5 V ~ 5.3 V（单电源供电，兼容常见 MCU/FPGA 控制电平）
- 工作温度：-45 ℃ ~ +85 ℃（工业级温度范围，适应多种环境）
- 封装：SOT-363（紧凑型，利于高密度 PCB 布局）
三、典型应用场景
- 无线通信射频前端（天线切换、分支/合路）
- IoT、可穿戴与便携式终端的射频开关模块
- 测试与测量设备中的射频路径选择
- 多模/多频终端中用于信号路由与隔离的模块
四、设计与使用建议
- 射频链路中建议保持 50 Ω 体系匹配，必要时在输入/输出端使用直流隔离电容和阻抗匹配网络。
- 控制信号采用清洁的数字电平，且在电源和控制引脚应用去耦电容以抑制干扰。
- 布局时保证良好接地并缩短射频走线长度以减少寄生损耗与漏辐射。
- 注意器件的功率承受能力、频率范围与开关速度等关键参数，请参考完整数据手册以确认是否满足系统要求。
五、封装与可靠性
SOT-363 封装有利于小体积系统的实现，但对焊接工艺、回流温度曲线及 ESD 防护提出较高要求。制造和测试过程中建议遵循厂方的封装与回流规范，必要时进行温度/振动/热循环评估。
六、选型与采购注意事项
在最终选型前，应向供应商或厂商索取完整版技术手册，确认频率响应、最大输入功率、开关时序、控制逻辑和环境合规性（如 RoHS）等信息。信路达（XINLUDA）品牌提供了该型号的标准产品，SOT-363 封装便于批量贴片生产与自动化装配。
如需进一步的等效电路建议、参考原理图或布局示意，可提供系统应用场景与频段需求，我可以给出更具体的设计意见。
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