WMSIC Electronic Components

XINLUDA XL2803A

ModelXL2803A
PackageSOP-18-300mil
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XL2803A
Type
XINLUDA
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XL2803A
Electronic Component
1
Package
SOP-18-300mil
Type
BJT
Electronic Component
Darlington Transistor Array
Electronic Component
0.73g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0228558275
Operating Temperature
65℃~+150℃
Current(Ir)
50uA
(Vf)
1.7V
Capacitor(Ci)
15pF
Current(on)
0.93mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL2803A 产品概述

一、产品简介

XL2803A(品牌:XINLUDA/信路达)是一款八路达林顿晶体管阵列,采用 SOP-18-300mil 封装,面向需要多通道电平放大与开集电极驱动的应用场景。每通道由达林顿结构构成,便于把低电流逻辑信号转换为可驱动较大负载的电流输出,适用于继电器、LED 矩阵、小功率电机和各种开关负载的驱动。

二、主要特性

  • 通道数:8 路达林顿输出,独立输入与输出通道。
  • 最大输入电压(VI):30 V,支持较高电压的输入侧信号幅度。
  • 工作温度范围:-65 ℃ 至 +150 ℃,适合宽温区工作环境。
  • 低静态漏电:集电极漏电流 Icex ≈ 50 μA(典型/最大量级),减少断态泄漏。
  • 输入驱动电流:导通输入电流约 0.93 mA,关断输入电流约 65 μA,便于与常见逻辑电平直接匹配。
  • 达林顿正向压降 Vf ≈ 1.7 V(驱动端或二极管特性标注),反向漏电 Ir ≈ 50 μA。
  • 输入电容 Ci ≈ 15 pF,影响高速切换下的上升/下降时间。
  • 封装:SOP-18-300mil,便于 PCB 布局与自动贴装。

三、主要电气参数(设计参考)

  • 输入最大允许电压 30 V(不建议长期在极限值工作,应留裕量)。
  • 导通输入电流 0.93 mA,设计驱动器时以此为基准计算输入负载。
  • 关断时输入泄漏 65 μA,应在高精度感测回路中考虑该偏置误差。
  • 集电极漏电流 50 μA,断态输出仍有微小泄漏。
  • 输入电容 15 pF,多个通道并联或高速驱动时需注意信号完整性。

(注:本文列举为关键参数摘要,完整绝对最大额定值、VCE(sat)、功耗和引脚排列请参见厂家完整数据手册。)

四、典型应用场景

  • 微控制器/逻辑电路到继电器、灯、蜂鸣器等设备的驱动接口;
  • 数码管/LED 矩阵的行/列驱动;
  • 工业控制信号放大与馈电控制;
  • 需要多通道小型功率开集电极输出的场合。

五、设计与使用注意事项

  • 达林顿结构本身会带来较高的饱和压降,应在电源及负载设计时预留足够余量;
  • 驱动感性负载(继电器、线圈、阀门)时必须并联反向续流二极管或选用外部钳位电路以保护器件;
  • 多通道同时导通会增加封装内功耗与结温,需评估散热条件与热关断余量;
  • 高速开关时需考虑输入电容与走线寄生,必要时加输入限流或消抖处理;
  • 若工作在极端温度(接近 ±150 ℃)下,请验证长期可靠性与温漂特性。

六、封装与可靠性

XL2803A 提供标准 SOP-18-300mil 封装,适合自动化贴片生产。器件额定的宽温范围适用于严苛环境,但在长期高温、高功耗工作下应采取散热和热设计措施。建议在设计前参考 XINLUDA 的完整规格书与可靠性测试报告以获得详尽的引脚配置、热阻参数和应用建议。

如需更详细的电气特性曲线、引脚图和典型等效电路,请联系供应商或查阅 XL2803A 的正式数据手册。

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