WMSIC Electronic Components

XINLUDA XL2515QF20

ModelXL2515QF20
PackageQFN-20-EP(4x4)
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XL2515QF20
Type
XINLUDA
Minimum package
3300 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XL2515QF20
Electronic Component
1
Package
QFN-20-EP(4x4)
Type
CANController
Electronic Component
CANController
Electronic Component
0.18g
Electronic Component
1
Features
Low Power
Electronic Component
BM0228561640
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~5.5V
Operating Current
5mA
Data
1Mbps
Communication Interface
SPI

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL2515QF20 产品概述

一、产品简介

XL2515QF20 是信路达(XINLUDA)推出的一款高性能 CAN 控制器,面向车载、工业和楼宇控制等需要可靠通信的场景。器件支持最高 1 Mbps 的 CAN 数据速率,采用 SPI 串行外设接口,方便与微控制器对接。封装为 QFN-20-EP (4x4),体积小、散热性能良好,适合空间受限的 PCB 设计。

二、主要性能特点

  • 类型:CAN 控制器(符合常见 CAN 协议栈需求)
  • 数据速率:最高 1 Mbps,满足高速 CAN 总线应用
  • 工作电压:2.7 V 至 5.5 V,兼容 3.3 V 与 5 V 系统
  • 工作电流:典型 5 mA(正常工作态),低功耗设计
  • 静态电流:待机 5 μA(低电流睡眠态),适合能耗敏感系统
  • 工作温度:-40 ℃ 至 +85 ℃,满足工业级温度要求
  • 通信接口:SPI,支持标准 SPI 时序与外设控制
  • 封装:QFN-20-EP (4x4),利于自动贴装与热设计

三、应用场景

XL2515QF20 适用于多种需要可靠 CAN 通信的场合,典型应用包括:

  • 汽车电子:车身控制模块、仪表、车载网关等
  • 工业控制:PLC、运动控制器、传感器网络
  • 楼宇与安防:门禁系统、楼宇自控总线
  • 智能设备与物联网终端:电源管理、数据采集节点

四、接口与使用建议

XL2515QF20 采用 SPI 接口与主控芯片通信,建议在 PCB 布局时:

  • SPI 时钟与数据线保持短线并加地线屏蔽,减少噪声耦合
  • 提供稳压电源与合适去耦电容(靠近供电引脚 0.1 μF + 1 μF)
  • 在 CAN 总线物理层外加装对应的 CAN 收发器(若需要差分收发)
  • 使用待机/唤醒引脚管理低功耗模式,实现 5 μA 静态电流下的能耗最小化

五、封装与可靠性

QFN-20-EP (4x4) 封装有利于热量通过 exposed pad 散出,推荐 exposed pad 焊盘接地并加焊盘锡,以提高热性能与机械强度。器件工作温度范围为 -40 ℃ 到 +85 ℃,适配工业级温度循环与长期可靠性需求。

六、优势要点

  • 宽电压范围兼容多种母板电源设计(2.7 V–5.5 V)
  • 低功耗特性:工作电流仅 5 mA,待机 5 μA,利于电池式与节能系统
  • 标准 SPI 接口,便于与主控 MCU 快速集成
  • 紧凑 QFN 封装,适合高密度布局与批量贴装

如需原理框图、引脚定义或参考电路图,可根据具体应用场景进一步提供设计资料与布局建议。

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