WMSIC Electronic Components

YJYCOIN YI201209A401-3R0T YI201209A401

ModelYI201209A401-3R0T
Package0805
BrandYJYCOIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJYCOIN YI201209A401-3R0T
Type
YJYCOIN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJYCOIN
Electronic Component
YI201209A401-3R0T
Electronic Component
1
Package
0805
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.039g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264968352
Operating Temperature
55℃~+125℃
Current
3A
@Frequency
400Ω@100MHz
Resistor(DCR)
40mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YI201209A401-3R0T 高频抑制磁珠产品概述

YI201209A401-3R0T是YJYCOIN(益嘉源)推出的0805封装高频铁氧体磁珠,针对中高频噪声抑制场景优化设计,在小体积(2012公制尺寸)下平衡了阻抗性能、电流承载能力与宽温稳定性,适合高密度电路的噪声滤波需求。

一、产品定位与核心价值

该磁珠属于工业级宽温型高频抑制元件,核心价值体现在三个维度:

  1. 小封装大电流:0805封装(约2.0mm×1.2mm)下实现3A额定电流,适配手机、路由器等高密度PCB设计;
  2. 精准高频抑制:在100MHz关键频段提供400Ω阻抗(±25%误差),针对性衰减开关电源、射频电路的高频噪声;
  3. 宽温环境兼容:-55℃~+125℃的工作温度范围,满足工业现场、户外设备等极端环境需求。

二、关键性能参数深度解析

1. 高频阻抗特性

磁珠的核心作用是高频噪声抑制,该产品在100MHz频段的阻抗为400Ω(±25%误差),属于行业常见的“有效抑制点”——100MHz是开关电源(如DC-DC)、蓝牙/WiFi等射频电路的典型噪声频段,此阻抗值可有效衰减该频段的干扰信号,提升电路EMC性能。

2. 直流电阻(DCR)与功率损耗

低DCR(40mΩ)是大电流应用的关键:

  • 额定电流3A下,功率损耗仅为 ( I^2R = 3^2 \times 0.04 = 0.36W ),发热可控,避免因过热影响电路可靠性;
  • 低DCR还能减少电源路径的压降,适合对效率要求较高的电源滤波场景(如DC-DC输出端)。

3. 温区与可靠性

-55℃+125℃的宽温范围,说明磁珠的铁氧体材料在极端温度下性能稳定(无显著阻抗漂移或磁饱和风险),可覆盖工业控制(-40℃+85℃)、车载子系统(-40℃~+105℃)等场景的温度需求。

三、封装设计与焊接兼容性

该产品采用0805贴片封装(公制2012),具备以下优势:

  1. 贴装效率高:适配常规SMT生产线,回流焊、波峰焊工艺成熟,良率稳定(符合IPC-A-610标准);
  2. PCB空间节省:小尺寸适合高密度电路设计,尤其适合手机、工业控制器等对空间敏感的设备;
  3. 焊接可靠性:封装引脚设计采用镀锡工艺,可避免虚焊、冷焊等问题,适合批量生产。

四、典型应用场景匹配

结合参数特性,该磁珠主要应用于以下场景:

  1. 开关电源滤波:DC-DC转换器输出端、AC-DC电源的EMI滤波,抑制100MHz左右的开关噪声;
  2. 射频电路噪声抑制:蓝牙、WiFi、LoRa等无线模块的电源/信号线,减少高频干扰对信号质量的影响;
  3. 工业控制电路:PLC、伺服驱动器、传感器模块的信号滤波,宽温适配工业现场的极端温度;
  4. 车载电子子系统:车载信息娱乐系统、胎压监测模块的噪声抑制(若需车规级,需确认品牌AEC-Q200认证,但宽温基础可覆盖部分场景)。

五、选型与使用注意事项

  1. 电流降额:实际使用电流建议不超过2.4A(降额20%,工程常规操作),避免长期过载导致磁饱和或发热;
  2. 阻抗曲线匹配:若应用场景的噪声频率偏离100MHz,需向厂家索取完整阻抗曲线,确认抑制效果;
  3. 焊接工艺:回流焊温度需符合IPC-7525标准(峰值温度245℃±5℃,时间30~60s),避免高温损坏磁珠;
  4. 环境验证:若用于-55℃或+125℃极端温度,需提前做环境测试,确认阻抗、DCR等参数无显著变化。

该产品以“小封装+大电流+宽温高频抑制”为核心竞争力,适配中高端电子设备的噪声滤波需求,是高密度电路设计中性价比突出的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.