Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
YSPI0530-220M是益嘉源(YJYCOIN)推出的小型化一体成型功率电感,核心面向中小功率电源管理场景设计,兼顾性能与成本优势。其型号命名遵循行业通用规则,各部分含义清晰:
该产品采用SMD贴片封装,支持自动化贴装生产,是消费电子、物联网等领域的高性价比选型。
YSPI0530-220M的参数围绕电感特性、功率能力、封装尺寸三大维度优化,关键参数及意义如下:
电感值22μH,精度±20%——满足DC-DC转换器、滤波电路等场景的常规电感需求,±20%的精度可覆盖多数中小功率电源的设计裕量(无需额外高精度要求时可降低成本)。
5.4×5.2×3mm(长×宽×高)——小型化设计适配便携设备、紧凑模块的空间限制,相比传统绕线电感体积更小。
相比传统绕线电感,YSPI0530-220M的一体成型结构带来显著技术优势:
一体成型工艺减少磁漏,降低对周边电路的电磁干扰,适合智能设备、通信模块等对EMI要求较高的场景(无需额外磁屏蔽处理)。
无外露磁芯和绕组,抗振动、抗冲击能力强,可适应运输过程及工业环境的振动场景,降低失效风险。
230mΩ的低DCR配合优化磁芯材料,减少功率损耗,提升电源转换效率(实测在2A负载下,损耗仅约0.92W)。
SMD贴片封装支持高速贴装,降低生产制造成本,适合批量生产需求。
YSPI0530-220M的参数与特性匹配中小功率电源管理场景,典型应用包括:
智能手机、平板电脑的核心电源模块(如CPU供电、电池充电电路的DC-DC转换器)。
路由器、机顶盒、智能网关的电源电路,以及传感器节点的低功耗电源管理(工作电流≤2A)。
智能插座、扫地机器人的辅助电源,智能音箱的电源模块(兼顾小体积与功率需求)。
小型PLC、远程传感器的低功率电源部分(工作环境温度范围适配-40℃~+125℃)。
为确保产品性能稳定,选型及使用需注意以下要点:
实际工作电流建议不超过额定电流的80%(即≤1.6A),避免长期过载导致温升过高,缩短电感寿命。
±20%的精度适合对电感值要求不苛刻的电路,若需高精度(如±10%)需更换带“K”标识的型号。
需确认PCB焊盘尺寸与5.4×5.2mm匹配,焊接温度曲线遵循SMD贴片电感常规参数(回流焊峰值温度≤245℃)。
工作环境温度建议在-40℃~+125℃之间,避免极端高温(如≥130℃)导致磁芯性能下降。
虽低EMI,但仍需与高频电路保持合理间距(≥5mm),避免潜在干扰。
YSPI0530-220M凭借小型化、低损耗、高可靠性等特点,可有效满足中小功率电源的设计需求,是电子设备电源管理模块的高性价比选型。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products